PIC16C54-XT/P Microchip Technology, PIC16C54-XT/P Datasheet - Page 205

• Manufacturer Part Number: PIC16C54-XT/P
• Description: IC MCU OTP 512X12 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C54-XT/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 12
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Package: 18PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Core: PIC
• Processor Series: PIC16C
• Maximum Clock Frequency: 40 MHz
• Data Ram Size: 25 B
• Data Rom Size: 512 B
• Mounting Style: Through Hole
• Height: 3.3 mm
• Length: 22.86 mm
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Supply Voltage (max): 6.25 V
• Supply Voltage (min): 3 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

1998 Microchip Technology Inc.
*
18-Lead CERDIP Windowed
28-Lead CERDIP Skinny Windowed
28-Lead CERDIP Windowed
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: MM...M
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
XX...X
AA
BB
C
D
E
AABBCDE
MMMMMMMMMMMMMM
MMMMMMMMMMMMMM
MMMMMMMM
MMMMMMMM
AABBCDE
MMMMMMMMMMM
MMMMMMMMMMM
AABBCDE
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Preliminary
Example
Example
Example
9801 CBA
PIC16C54
/JW
PIC16C57
/JW
PIC16C57
/JW
9838 CCT
9838 CBA
PIC16C5X
DS30453B-page 205