PIC16C54-XT/P Microchip Technology, PIC16C54-XT/P Datasheet - Page 200

• Manufacturer Part Number: PIC16C54-XT/P
• Description: IC MCU OTP 512X12 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C54-XT/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 12
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Package: 18PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Core: PIC
• Processor Series: PIC16C
• Maximum Clock Frequency: 40 MHz
• Data Ram Size: 25 B
• Data Rom Size: 512 B
• Mounting Style: Through Hole
• Height: 3.3 mm
• Length: 22.86 mm
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Supply Voltage (max): 6.25 V
• Supply Voltage (min): 3 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16C5X
Package Type:
DS30453B-page 200
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
n
p
†
‡
*
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
K04-072 20-Lead Plastic Shrink Small Outine (SS) – 5.30 mm
R1
E1
E
p
n
A
A1
A2
D
E
E1
R1
R2
L
L1
c
B
‡
†
‡
MIN
L1
0.068
0.026
0.002
0.278
0.205
0.301
0.005
0.005
0.015
0.000
0.005
0.010
Preliminary
2
1
0
0
0
D
L
R2
INCHES
NOM
0.026
0.073
0.036
0.005
0.283
0.208
0.306
0.005
0.005
0.020
0.005
0.007
0.012
A2
20
A
4
5
5
MAX
0.078
0.046
0.008
0.289
0.212
0.311
0.010
0.010
0.025
0.010
0.009
0.015
10
10
8
MIN
1.73
0.66
0.05
7.07
5.20
7.65
0.13
0.13
0.38
0.00
0.13
0.25
MILLIMETERS*
0
0
0
1998 Microchip Technology Inc.
NOM
0.65
1.86
0.91
0.13
7.20
5.29
7.78
0.13
0.13
0.51
0.13
0.18
0.32
20
4
5
5
MAX
A1
1.99
1.17
0.21
7.33
5.38
7.90
0.25
0.25
0.64
0.25
0.22
0.38
10
10
8