PIC16C54-XT/P Microchip Technology, PIC16C54-XT/P Datasheet - Page 196

• Manufacturer Part Number: PIC16C54-XT/P
• Description: IC MCU OTP 512X12 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C54-XT/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 12
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Package: 18PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Core: PIC
• Processor Series: PIC16C
• Maximum Clock Frequency: 40 MHz
• Data Ram Size: 25 B
• Data Rom Size: 512 B
• Mounting Style: Through Hole
• Height: 3.3 mm
• Length: 22.86 mm
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Supply Voltage (max): 6.25 V
• Supply Voltage (min): 3 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16C5X
Package Type:
DS30453B-page 196
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
†
‡
* Controlling Parameter.
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
n
K04-070 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil
R
eB
E1
E
2
1
c
D
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
‡
‡
A2
†
A
MIN
0.016
0.040
0.000
0.008
0.140
0.070
0.015
0.125
1.345
0.280
0.270
0.320
Preliminary
5
5
INCHES*
NOM
B
B1
0.300
0.100
0.019
0.053
0.005
0.010
0.150
0.090
0.020
0.130
1.365
0.288
0.283
0.350
28
10
10
MAX
0.022
0.065
0.010
0.012
0.160
0.110
0.025
0.135
1.385
0.295
0.295
0.380
15
15
MIN
34.16
0.41
1.02
0.00
0.20
3.56
1.78
0.38
3.18
7.11
6.86
8.13
MILLIMETERS
5
5
1998 Microchip Technology Inc.
NOM
p
34.67
7.62
2.54
0.48
1.33
0.13
0.25
3.81
2.29
0.51
3.30
7.30
7.18
8.89
28
10
10
L
A1
MAX
35.18
0.56
1.65
0.25
0.30
4.06
2.79
0.64
3.43
7.49
7.49
9.65
15
15