MC9S12C128CFUE Freescale Semiconductor, MC9S12C128CFUE Datasheet - Page 669

• Manufacturer Part Number: MC9S12C128CFUE
• Description: IC MCU 128K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12C128CFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 60
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/2.97V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12C
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 4000 B
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 61
• Number Of Timers: 1
• Operating Supply Voltage: - 0.3 V to + 6.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912C32EE
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

1. % deviation from target frequency
2. f
A.5
A.5.1
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency f
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash program and erase operations are timed using a clock derived from the oscillator using the
FCLKDIV and ECLKDIV registers respectively. The frequency of this clock must be set within the limits
specified as f
The minimum program and erase times shown in
maximum f
Freescale Semiconductor
Conditions are shown in
Num C
10
11
12
13
14
15
1
2
3
4
5
6
7
8
9
OSC
= 4MHz, f
D VCO locking range
D
D Lock Detection
D Un-Lock Detection
D
C PLLON Total Stabilization delay (Auto Mode)
D PLLON
D PLLON Tracking mode stabilization delay
D Fitting parameter VCO loop gain
D Fitting parameter VCO loop frequency
D Charge pump current acquisition mode
D Charge pump current tracking mode
C Jitter fit parameter 1
C Jitter fit parameter 2
P Self Clock Mode frequency
Lock Detector transition from Acquisition to Tracking
mode
Lock Detector transition from Tracking to Acquisition
mode
NVM, Flash, and EEPROM
bus
NVM Timing
NVMOP
BUS
. The maximum times are calculated for minimum f
Acquisition
= 25MHz equivalent f
.
Table A-4
NVMOSC
mode stabilization delay
2
2
Rating
unless otherwise noted
is required for performing program or erase operations. The NVM modules
VCO
MC9S12C-Family / MC9S12GC-Family
Table A-17. PLL Characteristics
= 50MHz: REFDV = #$03, SYNR = #$018, Cs = 4.7nF, Cp = 470pF, Rs = 10K
2
2
(2)
Rev 01.24
Table A-18
Symbol
|∆
f
|∆
|∆
| i
| i
f
|∆
t
t
SCM
VCO
stab
Lock|
acq
K
t
f
ch
ch
j
j
unt|
unl|
al
trk|
1
2
1
1
|
|
are calculated for maximum f
NVMOP
Min
0.5
—
—
—
—
—
—
—
—
—
1
8
3
0
6
and a f
Appendix A Electrical Characteristics
-100
38.5
Typ
0.5
0.3
0.2
3.5
—
—
—
—
—
—
60
—
—
bus
of 2MHz.
Max
0.13
5.5
1.5
2.5
1.1
50
—
—
—
—
—
—
—
NVMOP
4
8
MHz/V
and
MHz
MHz
MHz
Unit
%
%
%
%
ms
ms
ms
µA
µA
%
%
(1)
1
1
1
669
Ω
.