C8051F344-GQ Silicon Laboratories Inc, C8051F344-GQ Datasheet - Page 4

• Manufacturer Part Number: C8051F344-GQ
• Description: IC 8051 MCU FLASH 64K 48TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F34xr

Specifications of C8051F344-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 48-TQFP, 48-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 40
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 20x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 5.25 KB
• Interface Type: I2C/SMBus/SPI/UART/USB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 40
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F340DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 17-ch x 10-bit
• No. Of I/o's: 40
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Rohs Compliant: Yes
• Package: 48TQFP
• Device Core: 8051
• Family Name: C8051F34x
• Maximum Speed: 25 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1748 - ADAPTER TOOLSTICK FOR C8051F34X770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1452 - ADAPTER PROGRAM TOOLSTICK F340
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1302

C8051F340/1/2/3/4/5/6/7/8/9
10. Prefetch Engine .................................................................................................... 109
11. Reset Sources....................................................................................................... 111
12. Flash Memory ....................................................................................................... 119
13. External Data Memory Interface and On-Chip XRAM........................................ 127
4
9.3. Interrupt Handler ............................................................................................... 96
9.4. Power Management Modes ............................................................................ 105
11.1.Power-On Reset ............................................................................................. 112
11.2.Power-Fail Reset / VDD Monitor .................................................................... 113
11.3.External Reset ................................................................................................ 114
11.4.Missing Clock Detector Reset ........................................................................ 114
11.5.Comparator0 Reset ........................................................................................ 114
11.6.PCA Watchdog Timer Reset .......................................................................... 114
11.7.Flash Error Reset ........................................................................................... 114
11.8.Software Reset ............................................................................................... 115
11.9.USB Reset...................................................................................................... 115
12.1.Programming The Flash Memory ................................................................... 119
12.2.Non-Volatile Data Storage.............................................................................. 121
12.3.Security Options ............................................................................................. 121
13.1.Accessing XRAM............................................................................................ 127
13.2.Accessing USB FIFO Space .......................................................................... 128
13.3.Configuring the External Memory Interface .................................................... 129
13.4.Port Configuration........................................................................................... 129
13.5.Multiplexed and Non-multiplexed Selection.................................................... 132
13.6.Memory Mode Selection................................................................................. 133
13.7.Timing .......................................................................................................... 135
9.2.7. Register Descriptions ............................................................................... 94
9.3.1. MCU Interrupt Sources and Vectors ........................................................ 96
9.3.2. External Interrupts .................................................................................... 96
9.3.3. Interrupt Priorities ..................................................................................... 97
9.3.4. Interrupt Latency ...................................................................................... 97
9.3.5. Interrupt Register Descriptions................................................................. 98
9.4.1. Idle Mode................................................................................................ 105
9.4.2. Stop Mode .............................................................................................. 105
12.1.1.Flash Lock and Key Functions ............................................................... 119
12.1.2.Flash Erase Procedure .......................................................................... 119
12.1.3.Flash Write Procedure ........................................................................... 120
13.1.1.16-Bit MOVX Example ........................................................................... 127
13.1.2.8-Bit MOVX Example ............................................................................. 127
13.5.1.Multiplexed Configuration....................................................................... 132
13.5.2.Non-multiplexed Configuration............................................................... 133
13.6.1.Internal XRAM Only ............................................................................... 134
13.6.2.Split Mode without Bank Select.............................................................. 134
13.6.3.Split Mode with Bank Select................................................................... 135
13.6.4.External Only.......................................................................................... 135
13.7.1.Non-multiplexed Mode ........................................................................... 137
Rev. 1.1