PIC18F442-I/PT Microchip Technology, PIC18F442-I/PT Datasheet - Page 316

• Manufacturer Part Number: PIC18F442-I/PT
• Description: IC MCU FLASH 8KX16 EE A/D 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F442-I/PT

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC18
• No. Of I/o's: 34
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Package: 44TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 34
• Interface Type: I2C/SPI/USART
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18FXX2
APPENDIX C:
This appendix discusses the considerations for con-
verting from previous versions of a device to the ones
listed in this data sheet. Typically, these changes are
due to the differences in the process technology used.
An example of this type of conversion is from a
PIC16C74A to a PIC16C74B.
DS39564C-page 314
Not Applicable
CONVERSION
CONSIDERATIONS
APPENDIX D:
This section discusses how to migrate from a Baseline
device (i.e., PIC16C5X) to an Enhanced MCU device
(i.e., PIC18FXXX).
The following are the list of modifications over the
PIC16C5X microcontroller family:
Not Currently Available
MIGRATION FROM
BASELINE TO
ENHANCED DEVICES
© 2006 Microchip Technology Inc.