PIC18F442-I/PT Microchip Technology, PIC18F442-I/PT Datasheet - Page 312

• Manufacturer Part Number: PIC18F442-I/PT
• Description: IC MCU FLASH 8KX16 EE A/D 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F442-I/PT

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC18
• No. Of I/o's: 34
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Package: 44TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 34
• Interface Type: I2C/SPI/USART
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC18FXX2
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39564C-page 310
Note:
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-076
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
A2
D1
n1
E1
A1
D
B
n
p
A
L
F
E
c
n
MIN
.004
.039
.037
.002
.018
.463
.463
.390
.390
.012
.025
2
1
0
5
5
D1
L
.039 REF.
CH x 45°
INCHES
D
NOM
.031
44
11
.043
.039
.004
.024
.472
.472
.394
.394
.006
.015
.035
A1
3.5
10
10
A
F
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.30
0.64
0.09
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
1.10
1.00
0.10
0.60
0.15
0.38
0.89
Revised 07-22-05
3.5
10
10
0.80
44
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7