S202TY1F Sharp Microelectronics, S202TY1F Datasheet
S202TY1F
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S202TY1F Summary of contents
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... S102T02 Series and S202T02 Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 3.0kV isolation (V (rms) ) from input to out- iso put. ■ ...
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Internal Connection Diagram Zero Crossing Circuit ■ Outline Dimensions S102T02 ±0.2 23 ±0.2 7 Common to pin No.2 Common to pin No.2 ±0.2 ±0.2 6.4 φ 3.7 UL mark CSA mark Epoxy resin S 1 ...
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Date code (2 digit) 1st digit Year of production A.D. A.D Mark Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Peak one cycle surge current Repetitive S102T02 peak OFF-state voltage S202T02 Output Non-Repetitive S102T02 peak OFF-state voltage S202T02 Critical rate of rise of ON-state current Operating frequency ...
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Model Line-up (1) (Lead-free terminal components) Sleeve Shipping Package 25pcs/sleeve S102T02F Model No. S202T02F ■ Model Line-up (2) (Lead solder plating components) Sleeve Shipping Package 25pcs/sleeve S102T02 Model No. S202T02 Please contact a local SHARP sales representative to see ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Forward Current vs. Forward Voltage 100 T =75˚C a 50˚C 10 25˚C 0˚C −25˚C 1 0.1 0.6 0.8 1.0 ...
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Fig.7-a Repetitive Peak OFF-state Current vs. Ambient Temperature (S102T02) −3 10 −4 10 −5 10 −6 10 −7 10 −8 10 −9 10 − Ambient temperature T Remarks : Please be aware that all data in the ...
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Design Considerations ● Recommended Operating Conditions Parameter Input signal current at ON state Input Input signal current at OFF state S102T02 Load supply voltage S202T02 Output Load supply current Frequency Operating temperature ∗ See Fig.2 about derating ...
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Make sure there are no warps or bumps on the heat sink, insulation sheet and device surface. (b) Make sure there are no metal dusts or burrs attached onto the heat sink, insulation sheet and device sur- face. (c) ...
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Manufacturing Guidelines ● Soldering Method Flow Soldering (No solder bathing) Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please solder within one time. Other ...
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Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS Stopper : Olefine-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by stoppers. MAX. 20 sleeves in one case. Sleeve ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...