PG103003 Microchip Technology, PG103003 Datasheet - Page 6

• Manufacturer Part Number: PG103003
• Description: KIT PROGRAMMERS MICROID 13.56MHZ
• Manufacturer: Microchip Technology
• Series: MicroID®r
• Type: MicroID®r

Specifications of PG103003

• Contents: Programmer, Power Supply, Cable(s) and Software
• Product: RFID Kits
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MCRF355, MCRF360
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCRF355
TABLE 1-5:
TABLE 1-6:
DS21287G-page 6
Ant. A
Ant. B
V
V
CLK
V
Note 1: See Figure 3-1 for the connection with external resonant circuit.
Wafer Diameter
Die separation line width
Dice per wafer
Batch size
Bond pad opening
Die back grind thickness
Die passivation thickness (multilayer)
Die Size:
Die size X*Y before saw (step size)
Die size X*Y after saw
Note 1: The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at least 0.1 mil.
SS
DD
PRG
Note:
Name
2: Metal pad composition is 98.5% aluminum with 1% Si and 0.5% Cu.
3: As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as thick as the
4: The die passivation thickness (1.3 m) can vary by device depending on the mask set used.
application will allow.
-
-
Extreme care is urged in the handling and assembly of die products since they are susceptible to
mechanical and electrostatic damage.
-
Specifications
Layer 1: Oxide (undoped oxide)
Layer 2: PSG (doped oxide)
Layer 3: Oxynitride (top layer)
PAD FUNCTION TABLE
DIE MECHANICAL DIMENSIONS
Connected to external resonant circuit, (Note 1)
Connected to external resonant circuit, (Note 1)
Connected to external resonant circuit, (Note 1)
Device ground during Test mode
DC voltage supply for programming and Test mode
Main clock pulse for programming and Test mode
Input/Output for programming and Test mode
190.5
Min.
254
7.5
10
—
—
—
—
—
—
—
—
—
55.79 x 59.57
53.3 x 57.1
3.5 x 3.5
89 x 89
12,000
203.2
279.4
Typ.
1.3
80
24
11
8
8
Function
215.9
304.8
Max.
8.5
12
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—
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wafer
Unit
inch
die
mil
mil
mil
mil
mil
m
m
m
m
m
(Note 1, Note 2)
Sawed 8” wafer on frame
(option = WF) (Note 3)
• Bumped, sawed 8” wafer
• Unsawed wafer (option = W)
• Unsawed 8” bumped
(Note 4)
—
—
on frame (option = WFB)
wafer (option = WB), (Note 3)
© 2005 Microchip Technology Inc.
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