PG103003 Microchip Technology, PG103003 Datasheet - Page 5

• Manufacturer Part Number: PG103003
• Description: KIT PROGRAMMERS MICROID 13.56MHZ
• Manufacturer: Microchip Technology
• Series: MicroID®r
• Type: MicroID®r

Specifications of PG103003

• Contents: Programmer, Power Supply, Cable(s) and Software
• Product: RFID Kits
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MCRF355, MCRF360
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

TABLE 1-4:
FIGURE 1-1:
© 2005 Microchip Technology Inc.
Ant. A
Ant. B
V
V
CLK
V
Pad Name
SS
DD
PRG
Note 1: All coordinates are referenced from the center of the die. The minimum distance between pads (edge to
Die size before saw:
55.79 mil x 59.57 mil
2: Die Size = 1.417 mm x 1.513 mm = 1417 m x 1513 m = 55.79 mil x 59.57 mil
1417 m x 1513 m
edge) is 10 mil.
Lower
-610.0
-605.0
-605.0
Left X
463.4
463.4
463.4
Ant A
PAD COORDINATES (MICRONS)
Ant B
V
SS
DIE LAYOUT
Lower
-579.8
-181.4
Left Y
489.2
496.8
157.6
-58.2
x
x
x
458.4
432.6
Right X
Upper
-521.0
-516.0
-516.0
552.4
552.4
552.4
Right Y
Upper
-490.8
578.2
585.8
246.6
-92.4
30.8
1353.8 m x 1450.34 m
Die size after saw:
53.3 mil x 57.1 mil
1157.4
1417
Y (Notch edge of wafer)
1162.4
Pad Width
Passivation Openings
89
89
89
89
89
89
250.2
250
Pad Height
x
x
x
89
89
89
89
89
89
V
CLK
V
DD
PRG
MCRF355
Bond pad size:
3.5 mil x 3.5 mil
89 m x 89 m
Center X
-565.5
-560.5
-560.5
507.9
507.9
507.9
Pad
X
DS21287G-page 5
Center Y
-535.3
-136.9
533.7
541.3
202.1
-13.7
Pad