HW-SPAR3E-SK-US-G Xilinx Inc, HW-SPAR3E-SK-US-G Datasheet - Page 8
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HW-SPAR3E-SK-US-G
Manufacturer Part Number
HW-SPAR3E-SK-US-G
Description
KIT STARTER SPARTAN-3E
Manufacturer
Xilinx Inc
Specifications of HW-SPAR3E-SK-US-G
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1507
- XC3S100E-4VQG100C PDF datasheet
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Revision History
The following table shows the revision history for this document.
8
03/01/05
03/21/05
11/23/05
03/22/06
11/09/06
04/18/08
08/26/09
Date
Version
1.0
1.1
2.0
3.0
3.4
3.7
3.8
Initial Xilinx release.
Added XC3S250E in CP132 package to
for CP132 package. Added package markings for QFP packages
CP132/CPG132 packages
Added differential HSTL and SSTL I/O standards. Updated
input-only pins. Added
diagrams.
Upgraded data sheet status to Preliminary. Added XC3S100E in CP132 package and
updated I/O counts for the XC3S1600E in FG320 package
about dual markings for –5C and –4I product combinations to
Added 66 MHz PCI support and links to the Xilinx PCI LogiCORE data sheet. Indicated that
Stepping 1 parts are Production status. Promoted Module 1 to Production status.
Synchronized all modules to v3.4.
Added XC3S500E VQG100 package. Added reference to
links.
Added paragraph to
Added package sizes to
guarantee for devices having a single mark in paragraph 3 under
Deleted Pb-Free Packaging example under
under
Production
Stepping. Revised description of
Configuration
www.xilinx.com
Production Stepping
Table
(Figure
2. Described the speed grade and temperature range
4).
indicating the device supports MultiBoot configuration.
Revision
Table
Ordering
information, including example top marking
2. Corrected number of differential I/O pairs
Table
Information. Revised information
XA Automotive
3.
(Table
Table 2
Package
DS312-1 (v3.8) August 26, 2009
Package
(Figure
2). Added information
to indicate number of
Product Specification
Marking.
version. Updated
2) and
Marking.
R
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