MPC8308-RDB Freescale Semiconductor, MPC8308-RDB Datasheet - Page 25

• Manufacturer Part Number: MPC8308-RDB
• Description: BOARD REF DESIGN MPC8308
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MPUr

Specifications of MPC8308-RDB

• Contents: Board, Cables, Documentation, Power Supply, Software
• Ethernet Connection Type: Serial to Ethernet
• Data Rate: 10 Mbps, 100 Mbps, 1000 Mbps
• Memory Type: DDR2, SDRAM
• Interface Type: HSSI
• Operating Voltage: 1.5 V
• Operating Current: 5 uA
• Maximum Power Dissipation: 1000 mW
• Operating Temperature Range: - 55 C to + 125 C
• Product: Modules
• For Use With/related Products: MPC8308
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.10
DIP switch S1 on the board is shown in
RSVD[0:1] is reserved. When software options are implemented, its values can be read from a buffer on
the board. CFG_BOOT_ECC_DIS switch is OFF by default to disable booting with ECC by driving HIGH
to the signal LB_POR_CFG_BOOT_ECC_DIS (TSEC1_TX_ER) during power on reset. BOOT1 selects
the boot device on the RDB. By default, BOOT1 is set, so chip-select 0 (CS0) is connected to the NOR
Flash. CS1 is connected to the NAND flash memory. If BOOT1 is cleared, CS0 is connected to NAND
flash memory, and CS1 is connected to NOR flash memory.
3.11
DIP switch S2 selects the reset configuration source (RST_CFG_SRC) for the MPC8308.
the factory default configuration of S2.
Micetek International Inc.
DIP Switch S1
DIP Switch S2
Figure 22. IEEE 1588 Connector (P4) - Optional
PowerQUICC™ MPC8308_RDB User’s Guide, Rev. 3
TSEC_TMR_GCLK
TSEC_TMR_PP2
TSEC_TMR_PP3
TSEC_TMR_PP1
0
1
Figure
Figure 23. DIP Switch S1
GND
GND
GND
3.3 V
ON
1
23, with the factory default configuration.
1
2
3.3 V
TSEC_TMR_ALARM1
TSEC_TMR_ALARM2
TSEC_TMR_TRIG1
TSEC_TMR_TRIG2
TSEC_TMR_TRIG2
GND
TSEC_TMR_CLK
3
4
Connectors, Jumpers, Switches, and LEDs
Figure 24
shows
25