MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 113

• Manufacturer Part Number: MPC8536DS
• Description: BOARD DEV SYSTEM MPC8536E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8536DS

• Contents: Board, Software and Documentation
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Operating Supply Voltage: - 0.3 V to + 1.21 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Interface Type: SPI, USB
• Program Memory Type: DDR2, DDR3, SDRAM
• Core Size: 32 Bit
• Program Memory Size: 544KB
• Cpu Speed: 1.5GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 0.95V To 1.05V
• Rohs Compliant: Yes
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The recommended attachment method to the heat sink is illustrated in
printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the MPC8536E to function in various environments.
2.24.3.1
For the packaging technology, shown in
Figure 74
Freescale Semiconductor
•
•
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
Internal Package Conduction Resistance
(Note the internal versus external package resistance)
External Resistance
External Resistance
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Internal Resistance
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Thermal Interface Material
Printed-Circuit Board
Printed-Circuit Board
Table
Heat Sink
Heat Sink
Heat Sink
70, the intrinsic internal conduction thermal resistance paths are as follows:
Clip
Die
Radiation
Radiation
Convection
Convection
Figure
FC-PBGA Package
73. The heat sink should be attached to the
Thermal Interface Material
Die/Package
Die Junction
Package/Solder Spheres
Thermal
113