DEMO9S08DZ60 Freescale Semiconductor, DEMO9S08DZ60 Datasheet - Page 371

BOARD DEMO

DEMO9S08DZ60

Manufacturer Part Number
DEMO9S08DZ60
Description
BOARD DEMO
Manufacturer
Freescale Semiconductor
Type
MCUr

Specifications of DEMO9S08DZ60

Contents
Board, Cable, CD
Processor To Be Evaluated
MC9S08DZ60
Interface Type
RS-232, USB
Silicon Manufacturer
Freescale
Core Architecture
HCS08
Core Sub-architecture
HCS08
Silicon Core Number
MC9S08
Silicon Family Name
S08D
Kit Contents
MC9S08DZ60 Board, Software, Cables, Connectors
Rohs Compliant
Yes
For Use With/related Products
MC9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
1
2
I/O
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
is neglected) is:
T
θ
P
P
P
C
D
T
D
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
Operating temperature range (packaged)
Maximum Junction Temperature
Thermal resistance
= Power dissipation on input and output pins — user determined
int
DD
+ P
Single-layer board
Four-Layer board
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
K = P
2
int
Rating
and can be neglected. An approximate relationship between P
MC9S08DZ60 Series Data Sheet, Rev. 4
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
1
) in °C can be obtained from:
64-pin LQFP
48-pin LQFP
32-pin LQFP
64-pin LQFP
48-pin LQFP
32-pin LQFP
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
Symbol
× (P
θ
θ
θ
θ
θ
θ
T
T
JA
JA
JA
JA
JA
JA
A
J
D
)
2
–40 to 125
–40 to 105
–40 to 85
Value
135
Appendix A Electrical Characteristics
69
75
80
51
51
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Temp.
Code
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
M
C
V
and T
371
J

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