DEMO9S08DZ60 Freescale Semiconductor, DEMO9S08DZ60 Datasheet - Page 199

• Manufacturer Part Number: DEMO9S08DZ60
• Description: BOARD DEMO
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S08DZ60

• Contents: Board, Cable, CD
• Processor To Be Evaluated: MC9S08DZ60
• Interface Type: RS-232, USB
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08D
• Kit Contents: MC9S08DZ60 Board, Software, Cables, Connectors
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08DZ60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 11
Inter-Integrated Circuit (S08IICV2)
11.1
The inter-integrated circuit (IIC) provides a method of communication between a number of devices. The
interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is
capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The
maximum communication length and the number of devices that can be connected are limited by a
maximum bus capacitance of 400 pF.
All MC9S08DZ60 Series MCUs feature the IIC, as shown in the following block diagram.
Freescale Semiconductor
Introduction
Drive strength must be disabled (DSE=0) for the IIC pins when using the
IIC module for correct operation.
MC9S08DZ60 Series Data Sheet, Rev. 4
NOTE
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