LTM4609IV#PBF Linear Technology, LTM4609IV#PBF Datasheet - Page 19

• Manufacturer Part Number: LTM4609IV#PBF
• Description: IC BUCK/BOOST SYNC ADJ 4A 141LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM4609IV#PBF

• Design Resources: LTM4609 Spice Model
• Output: 0.8 ~ 34 V
• Number Of Outputs: 1
• Power (watts): 136W
• Mounting Type: Surface Mount
• Voltage - Input: 4.5 ~ 36 V
• Package / Case: 141-LGA
• 1st Output: 0.8 ~ 34 VDC @ 4A
• Size / Dimension: 0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
• Power (watts) - Rated: 136W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 98%
• Dc To Dc Converter Type: Non-Inverting/Inverting/Step Up/Step Down
• Pin Count: 141
• Input Voltage: 36V
• Output Voltage: 0.8 to 34V
• Switching Freq: 200 TO 400KHz
• Output Current: 4A
• Package Type: LGA
• Output Type: Adjustable
• Switching Regulator: Yes
• Load Regulation: -0.50%
• Line Regulation: 0.02%/V
• Mounting: Surface Mount
• Input Voltage (min): 4.5V
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Compliant

TYPICAL APPLICATIONS
APPLICATIONS INFORMATION
Table 4. Boost Mode
DERATING CURVE
Figure 7, 9
Figure 7, 9
Figure 7, 9
Figure 8, 10
Figure 8, 10
Figure 8, 10
Table 5. Buck Mode
DERATING CURVE
Figure 11, 13
Figure 11, 13
Figure 11, 13
Figure 12, 14
Figure 12, 14
Figure 12, 14
HEAT SINK MANUFACTURER
Wakefi eld Engineering
Aaivd Thermalloy
*The results of thermal resistance from junction to ambient θ
as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θ
Figure 13. 36V
0
8
7
6
5
4
3
2
1
25
35
36V
36V
36V
AMBIENT TEMPERATURE (°C)
IN
IN
IN
45
IN
TO 20V
TO 20V
TO 20V
to 20V
V
V
55
16, 30
16, 30
16, 30
16, 30
16, 30
16, 30
12, 20
12, 20
12, 20
12, 20
12, 20
12, 20
OUT
OUT
OUT
OUT
OUT
65
(V)
(V)
OUT
WITH 0LFM
WITH 200LFM
WITH 400LFM
75
without Heat Sink
85
95
POWER LOSS CURVE
POWER LOSS CURVE
PART NUMBER
LTN20069
375424B00034G
4609 F13
JA
.
105
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
JA
are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
AIR FLOW (LFM)
AIR FLOW (LFM)
200
400
200
400
200
400
200
400
0
0
0
0
Figure 14. 36V
8
7
6
5
4
3
2
1
0
25
PHONE NUMBER
603-635-2800
603-224-9988
35
36V
36V
36V
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
AMBIENT TEMPERATURE (°C)
IN
HEAT SINK
HEAT SINK
IN
IN
IN
45
TO 20V
TO 20V
TO 20V
to 20V
None
None
None
None
None
None
55
OUT
OUT
OUT
OUT
65
WITH 0LFM
WITH 200LFM
WITH 400LFM
with Heat Sink
75
85
LTM4609
95
4609 F14
θ
θ
JA
JA
105
11.4
11.0
(°C/W)*
(°C/W)*
8.5
7.5
7.9
7.1
8.2
5.9
5.4
7.5
5.3
4.8
19
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