LTM8027IV#PBF Linear Technology, LTM8027IV#PBF Datasheet - Page 16

• Manufacturer Part Number: LTM8027IV#PBF
• Description: IC BUCK SYNC ADJ 4A 113LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM8027IV#PBF

• Design Resources: LTM8027 Spice Model
• Output: 2.5 ~ 24 V
• Number Of Outputs: 1
• Power (watts): 96W
• Mounting Type: Surface Mount
• Voltage - Input: 4.5 ~ 60 V
• Package / Case: 113-LGA
• 1st Output: 2.5 ~ 24 VDC @ 4A
• Size / Dimension: 0.59" L x 0.59" W x 0.17" H (15mm x 15mm x 4.32mm)
• Power (watts) - Rated: 96W
• Operating Temperature: -40°C ~ 125°C
• Efficiency: 95%
• Primary Input Voltage: 60V
• No. Of Outputs: 1
• Output Voltage: 24V
• Output Current: 4A
• No. Of Pins: 113
• Operating Temperature Range: -40°C To +125°C
• Voltage Regulator Type: Buck DC/DC Converter
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -

LTM8027
APPLICATIONS INFORMATION
The junction-to-air and junction-to-board thermal resis-
tances given in the Pin Configuration diagram may also
be used to estimate the LTM8027 internal temperature.
These thermal coefficients are determined per JESD 51-9
(JEDEC standard, test boards for area array surface mount
package thermal measurements) through analysis and
physical correlation. Bear in mind that the actual thermal
resistance of the LTM8027 to the printed circuit board
depends upon the design of the circuit board.
Table 2. Recommended Component Values and Configuration
(T
16
V
20.5 to 60
10.5 to 40
20.5 to 40
10.5 to 52
10.5 to 60
A
4.5 to 60
7.5 to 60
4.5 to 40
4.5 to 40
7.5 to 40
4.5 to 56
4.5 to 55
IN
16 to 60
26 to 60
34 to 60
16 to 40
26 to 40
34 to 40
16 to 48
= 25°C. See Typical Performance Characteristics for load Conditions)
RANGE
(V)
V
–3.3
–12
(V)
3.3
2.5
3.3
15
18
24
15
18
24
–5
12
12
–8
OUT
5
8
5
8
2 × 4.7µF 2220 100V 5 × 100µF 1812 6.3V
2 × 4.7µF 2220 100V 4 × 100µF 1210 6.3V
2 × 4.7µF 2220 100V
2 × 4.7µF 2220 100V
2 × 4.7µF 2220 100V
2 × 4.7µF 2220 100V
2 × 4.7µF 2220 100V
2 × 4.7µF 2220 100V 5 × 100µF 1812 6.3V 8.5V to 15V Above Output
2 × 4.7µF 2220 100V 4 × 100µF 1210 6.3V 8.5V to 15V Above Output
2 × 4.7µF 2220 100V
2 × 4.7µF 2220 100V
2 × 10µF 2220 50V
2 × 10µF 2220 50V
2 × 10µF 2220 50V
2 × 10µF 2220 50V
2 × 10µF 2220 50V
1 × 10µF 2220 50V
1 × 10µF 2220 50V
1 × 10µF 2220 50V
C
IN
5 × 100µF 1812 6.3V
4 × 100µF 1812 6.3V
4 × 100µF 1210 6.3V
4 × 47µF 1210 10V
4 × 22µF 1210 16V
4 × 22µF 1210 16V
4 × 10µF 1812 25V
4 × 10µF 1812 25V
4 × 47µF 1210 10V
4 × 22µF 1210 16V
4 × 22µF 1210 16V
4 × 10µF 1812 25V
4 × 10µF 1812 25V
4 × 47µF 1210 10V
4 × 22µF 1210 16V
C
OUT
8.5V to 15V Above Output
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
8.5V to 15V
The die temperature of the LTM8027 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8027. The bulk of the heat flow out of the LTM8027
is through the bottom of the module and the LGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
BIAS1
AUX
AUX
AUX
AUX
AUX
R
(kΩ)
90.9
56.2
44.2
36.5
26.7
90.9
56.2
44.2
36.5
26.7
90.9
56.2
301
162
487
301
162
301
162
ADJ
f
OPTIMAL
(kHz)
115
210
260
300
350
400
430
145
165
210
260
300
350
400
430
115
190
260
300
R
OPTIMAL
(kΩ)
75.0
59.0
48.7
40.2
31.6
28.7
75.0
59.0
48.7
40.2
31.6
28.7
90.9
59.0
48.7
154
124
102
154
(kHz)
f
160
230
350
500
500
500
500
185
240
315
500
500
500
500
500
155
230
350
500
MAX
R
(kΩ)
68.2
40.2
23.7
23.7
23.7
23.7
88.7
64.9
45.3
23.7
23.7
23.7
23.7
23.7
68.2
40.2
23.7
107
115
MAX
8027fa