AFCT-701SDZ Avago Technologies US Inc., AFCT-701SDZ Datasheet - Page 2

• Manufacturer Part Number: AFCT-701SDZ
• Description: TXRX SFP+ SMF 10BGD 1310NM
• Manufacturer: Avago Technologies US Inc.
• Series: -r

Specifications of AFCT-701SDZ

• Data Rate: 10.312Gbd
• Wavelength: 1310nm
• Applications: Ethernet
• Voltage - Supply: 3.135 V ~ 3.465 V
• Connector Type: LC Duplex
• Mounting Type: SFP
• For Use With Fiber Type: Multimode
• Function: SFP+ 10 Gb ethernet transceiver
• Maximum Forward Current: 289 mA
• Maximum Power Dissipation: 1000 mW
• Transmission Distance: 10 Km
• Product: Transceiver
• Diode Capacitance: 14 pF
• Maximum Rise Time: 28 ps
• Maximum Fall Time: 28 ps
• Maximum Output Current: 20 mA
• Operating Supply Voltage: 3.465 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Supply Voltage: 3.3V
• Wavelength Typ: 1310nm
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With: Multimode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Description,
Installation
The AFCT-701SDZ transceiver package is compliant with
the SFF 8432 Improved Pluggable Formfactor housing
specification for the SFP+. It can be installed in any INF-
8074 or SFF-8431/2 compliant Small Form Pluggable
(SFP) port regardless of host equipment operating status
The AFCT-701SDZ is hot-pluggable, allowing the mod-
ule to be installed while the host system is operating and
on-line. Upon insertion, the transceiver housing makes
initial contact with the host board SFP cage, mitigating
potential damage due to Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identification
The two-wire interface protocol and signaling detail
are based on SFF-8431. Conventional EEPROM memo-
ry, bytes 0-255 at memory address 0xA0, is organized
in compliance with SFF-8431. New digital diagnostic
information, bytes 0-255 at memory address 0xA2, is
compliant to SFF-8472. The new diagnostic information
provides the opportunity for Predictive Failure Identifi-
cation, Compliance Prediction, Fault Isolation and Com-
ponent Monitoring.
Predictive Failure Identification
The AFCT-701SDZ predictive failure feature allows a host
to identify potential link problems before system perfor-
mance is impacted. Prior identification of link problems
enables a host to service an application via “fail over”
to a redundant link or replace a suspect device, main-
taining system uptime in the process. For applications
where ultra-high system uptime is required, a digital SFP
provides a means to monitor two real-time laser metrics
associated with observing laser degradation and pre-
dicting failure: average laser bias current (Tx_Bias) and
average laser optical power (Tx_Power).
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continued
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFCT-701SDZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify po-
tential component compliance issues. Received optical
power is also available to assess compliance of a cable
plant and remote transmitter. When operating out of re-
quirements, the link cannot guarantee error free trans-
mission.
Fault Isolation
The fault isolation feature allows a host to quickly pin-
point the location of a link failure, minimizing downtime.
For optical links, the ability to identify a fault at a local
device, remote device or cable plant is crucial to speed-
ing service of an installation. AFCT-701SDZ real-time
monitors of Tx_Bias, Tx_Power, Vcc, Temperature and
Rx_Power can be used to assess local transceiver current
operating conditions. In addition, status flags TX_DIS-
ABLE and Rx Loss of Signal (LOS) are mirrored in memory
and available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AFCT-
701SDZ real-time monitors of Tx_Bias, Tx_Power, Vcc,
Temperature and Rx_Power. Potential uses are as debug-
ging aids for system installation and design, and trans-
ceiver parametric evaluation for factory or field quali-
fication. For example, temperature per module can be
observed in high density applications to facilitate ther-
mal evaluation of blades, PCI cards and systems.