AFBR-57R5APZ Avago Technologies US Inc., AFBR-57R5APZ Datasheet - Page 2

• Manufacturer Part Number: AFBR-57R5APZ
• Description: TXRX OPT SFP 4/2/1GBD 850NM
• Manufacturer: Avago Technologies US Inc.

Specifications of AFBR-57R5APZ

• Data Rate: 4.25GBd
• Wavelength: 850nm
• Voltage - Supply: 3.3V
• Connector Type: LC Duplex
• Mounting Type: SFP
• Function: Digital Diagnostic SFP, supports high-speed serial links over multimode optical fiber.
• Product: Transceiver
• Maximum Rise Time: 0.09 ns/0.15 ns
• Maximum Fall Time: 0.09 ns/0.15 ns
• Pulse Width Distortion: 0.06 ns (Max)/0.062 ns (Max)
• Operating Supply Voltage: 2.97 V to 3.63 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 10 C
• Package / Case: SFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Applications: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With: Multimode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1987

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Installation
The AFBR-57R5APZ can be installed in any SFF-8074i
compliant Small Form Pluggable (SFP) port regardless of
host equipment operating status. The AFBR-57R5APZ is
hot-pluggable, allowing the module to be installed while
the host system is operating and on-line. Upon insertion,
the transceiver housing makes initial contact with the
host board SFP cage, mitigating potential damage due
to Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identification
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conven-
tional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diagnostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diag-
nostic information provides the opportunity for Predic-
tive Failure Identification, Compliance Prediction, Fault
Isolation and Component Monitoring.
Predictive Failure Identification
The AFBR-57R5APZ predictive failure feature allows a host
to identify potential link problems before system perfor-
mance is impacted. Prior identification of link problems
enables a host to service an application via “fail over”
to a redundant link or replace a suspect device, main-
taining system uptime in the process. For applications
where ultra-high system uptime is required, a digital SFP
provides a means to monitor two real-time laser metrics
associated with observing laser degradation and pre-
dicting failure: average laser bias current (Tx_Bias) and
average laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-57R5APZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received
optical power is also available to assess compliance of
a cable plant and remote transmitter. When operating
out of requirements, the link cannot guarantee error free
transmission.
Fault Isolation
The fault isolation feature allows a host to quickly
pinpoint the location of a link failure, minimizing
downtime. For optical links, the ability to identify a fault
at a local device, remote device or cable plant is crucial to
speeding service of an installation. AFBR-57R5APZ real-
time monitors of Tx_Bias, Tx_Power, Vcc, Temperature and
Rx_Power can be used to assess local transceiver current
operating conditions. In addition, status flags Tx_Disable
and Rx Loss of Signal (LOS) are mirrored in memory and
available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the
AFBR-57R5APZ real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or field
qualification. For example, temperature per module can
be observed in high density applications to facilitate
thermal evaluation of blades, PCI cards and systems.