MT18VDDF12872HY-335D1 Micron Technology Inc, MT18VDDF12872HY-335D1 Datasheet - Page 21
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MT18VDDF12872HY-335D1
Manufacturer Part Number
MT18VDDF12872HY-335D1
Description
MODULE SDRAM DDR 512MB 200SODIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT18VDDF12872HY-335D1.pdf
(27 pages)
Specifications of MT18VDDF12872HY-335D1
Memory Type
DDR SDRAM
Memory Size
1GB
Speed
333MT/s
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
200SODIMM
Device Core Size
72b
Organization
128Mx72
Total Density
1GByte
Chip Density
512Mb
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
1.53A
Number Of Elements
18
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 65C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NOTE:
09005aef80e487d7
DDF18C64_128x72HG_A.fm - Rev. A 10/03 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across the module.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 10: Component Case Temperature vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
21
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512MB, 1GB (x72, ECC, DR)
200-PIN DDR SODIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2003 Micron Technology, Inc.