MT18LSDT6472G-13ED2 Micron Technology Inc, MT18LSDT6472G-13ED2 Datasheet - Page 14

• Manufacturer Part Number: MT18LSDT6472G-13ED2
• Description: MODULE SDRAM 512MB 168DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18LSDT6472G-13ED2

• Memory Type: SDRAM
• Memory Size: 512MB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168RDIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 4831838208
• Chip Density: 256Mb
• Access Time (max): 5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 2.43A
• Number Of Elements: 18
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 55C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 15: SDRAM Component Electrical Characteristics and Recommended AC
Notes: 5, 6, 8, 9, 11; notes appear on page 15
Table 16: AC Functional Characteristics
Notes: 5, 6, 7, 8, 9, 11; notes appear on page 15
16,32,Meg x 64 DDR SDRAM DIMMs (Footer Desc variable)
SD18C16_32_64x72G_B.fm - Rev. B 1/03 EN
ACTIV bank a to ACTIVE bank b command
Transition time
WRITE recovery time
Exit SELF REFRESH to ACTIVE command
READ/WRITEc ommand to READ/WRITE command
CKE to clock disable or power-down entry mode
CKE to clock enable or power-down exit setup mode
DQM to input data delay
DQM to data mask during WRITEs
DQM to data high-impedance during READs
WRITE command to input data delay
Data-in to ACTIVEcommand
Data-in to PRE CHARGEcommand
Last data-in to burst STOP command
Last data-in to new READ/WRITE command
Last data-in to PRECHARGEcommand
LOAD MODE REGISTER command t o ACTIVE or REFRESH command
Data-out to high-impedance from PRECHARGE
command
Operating Conditions (Continued)
AC CHARACTERISTICS
PARAMETER
PARAMETER
SYMBOL MIN
t
t
t
RRD
XSR
WR
t
T
CL=3
CL = 2
1 CLK
+ 7ns
168-PIN REGISTERED SDRAM DIMM
0.3
14
14
14
67
128MB, 256MB, 512MB (x72, ECC)
-13E
MAX
1.2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL -13E -133
t
t
+ 7.5ns
ROH(3)
ROH(2)
t
t
t
t
t
1 CLK
t
CKED
t
t
t
DQM
DWD
t
t
t
t
MIN
DQD
MRD
DQZ
CCD
DAL
PED
DPL
BDL
CDL
RDL
0.3
15
15
75
-133
MAX
1.2
1
1
1
0
0
2
0
4
2
1
1
2
2
3
2
1 CLK
+ 7ns
MIN
0.3
20
15
80
1
1
1
0
0
2
0
5
2
1
1
2
2
3
2
-10E
-10E UNITS
MAX
1.2
1
1
1
0
0
2
0
4
2
1
1
2
2
3
2
UNITS
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
©2003, Micron Technology Inc.
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
ns
ns
ns
ns
ns
15, 21, 32
16, 21, 32
16, 21, 32
NOTES
14, 32
14, 32
17, 32
17, 32
17, 32
17, 32
17, 32
17, 32
17, 32
17, 32
NOTES
17
26
24
25
20
7