MT16HTF12864HY-40EB3 Micron Technology Inc, MT16HTF12864HY-40EB3 Datasheet - Page 11

• Manufacturer Part Number: MT16HTF12864HY-40EB3
• Description: MODULE SDRAM DDR2 1GB 200SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT16HTF12864HY-40EB3

• Memory Type: DDR2 SDRAM
• Memory Size: 1GB
• Speed: 400MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 128Mx64
• Total Density: 1GByte
• Chip Density: 512Mb
• Access Time (max): 60ps
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 976mA
• Number Of Elements: 16
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Serial Presence-Detect
Table 12:
Table 13:
PDF: 09005aef818e4054/Source: 09005aef818e40d2
HTF16C128_256x64H.fm - Rev. B 11/06 EN
Parameter/Condition
Parameter/Condition
Supply voltage
Input high voltage: Logic 1; All inputs
Input low voltage: Logic 0; All inputs
Output low voltage: I
Input leakage current: V
Output leakage current: V
Standby current
Power supply current, READ: SCL clock frequency = 100 KHz
Power supply current, WRITE: SCL clock frequency = 100 KHz
SCL LOW to SDA data-out valid
Time the bus must be free before a new transition can start
Data-out hold time
SDA and SCL fall time
Data-in hold time
Start condition hold time
Clock HIGH period
Noise suppression time constant at SCL, SDA inputs
Clock LOW period
SDA and SCL rise time
SCL clock frequency
Data-in setup time
Start condition setup time
Stop condition setup time
WRITE cycle time
Serial Presence-Detect EEPROM DC Operating Conditions
All voltages referenced to V
Serial Presence-Detect EEPROM AC Operating Conditions
All voltages referenced to V
Notes:
OUT
IN
= 3mA
OUT
= GND to V
1. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL = 1
2. This parameter is sampled.
3. For a reSTART condition, or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
= GND to V
and the falling or rising edge of SDA.
sequence to the end of the EEPROM internal erase/program cycle. During the WRITE cycle,
the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-up resistor, and
the EEPROM does not respond to its slave address.
DD
SS
SS
DD
; V
; V
DDSPD
DDSPD
1GB, 2GB: (x64, DR) 200-Pin DDR2 SDRAM SODIMM
= +1.7V to +3.6V
= +1.7V to +3.6V
11
Symbol
t
Symbol
t
t
t
t
V
HD:DAT
HD:STA
SU:DAT
SU:STO
SU:STA
t
t
t
t
t
DDSPD
HIGH
I
LOW
f
WRC
t
t
WRC) is the time from a valid stop condition of a write
V
I
V
BUF
V
I
CC
I
SCL
CC
AA
DH
I
t
LO
t
SB
OL
t
LI
IH
R
F
IL
I
Micron Technology, Inc., reserves the right to change products or specifications without notice.
W
R
V
DDSPD
Min
200
100
0.2
1.3
0.6
0.6
1.3
0.6
0.6
0
–
–
–
–
–
Min
–0.6
0.10
0.05
1.7
1.6
0.4
2
–
× 0.7
Serial Presence-Detect
Max
300
400
0.9
0.3
50
10
–
–
–
–
–
–
–
–
–
©2004 Micron Technology, Inc. All rights reserved.
V
V
DDSPD
DDSPD
Max
3.6
0.4
3
3
4
1
3
Units
+ 0.5
× 0.3
KHz
ms
µs
µs
ns
ns
µs
µs
µs
ns
µs
µs
ns
µs
µs
Notes
Units
mA
mA
µA
µA
µA
V
V
V
V
1
2
2
3
4