MT18LSDT6472G-133D2 Micron Technology Inc, MT18LSDT6472G-133D2 Datasheet

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MT18LSDT6472G-133D2

Manufacturer Part Number
MT18LSDT6472G-133D2
Description
MODULE SDRAM 512MB 168DIMM
Manufacturer
Micron Technology Inc

Specifications of MT18LSDT6472G-133D2

Memory Type
SDRAM
Memory Size
512MB
Speed
133MHz
Package / Case
168-DIMM
Main Category
DRAM Module
Sub-category
SDRAM
Module Type
168RDIMM
Device Core Size
72b
Organization
64Mx72
Total Density
512MByte
Chip Density
256Mb
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
2.43A
Number Of Elements
18
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 55C
Operating Temperature Classification
Commercial
Pin Count
168
Mounting
Socket
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
SYNCHRONOUS
DRAM MODULE
Features
• JEDEC-standard 168-pin, dual in-line memory
• PC133- and PC100-compliant
• Registered inputs with one-clock delay
• Phase-lock loop (PLL) clock driver to reduce loading
• Utilizes 100 MHz and 133 MHz SDRAM
• ECC-optimized pinout
• Single +3.3V power supply
• Fully synchronous; all signals registered on positive
• Internal pipelined operation; column address can
• Internal SDRAM banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge and Auto Refresh Modes
• Self Refresh Mode
• 128MB and 256MB: 64ms, 4,096-cycle refresh;
• LVTTL-compatible inputs and outputs
• Serial Presence-Detect (SPD)
NOTE:
Table 1:
16,32,Meg x 64 DDR SDRAM DIMMs (Footer Desc variable)
SD18C16_32_64x72G_B.fm - Rev. B 1/03 EN
OPTIONS
• Package
• Frequency/CAS Latency
Refresh Count
Device Config.
Device Banks
Row Addressing 4K(A0–A11)
Column Addr.
Module Ranks
PARAMETER
module (DIMM)
components
edge of PLL clock
be changed every clock cycle
512MB: 64ms, 8,192-cycle refresh
168-pin DIMM (gold)
133 MHz/CL = 2
133 MHz/CL = 3
100 MHz/CL = 2
Registered mode adds one clock cycle to CL.
Address Table
4 (BA0, BA1) 4 (BA0, BA1) 4 (BA0, BA1)
16 Meg x 4
1K (A0–A9) 2K (A0–A9,A11) 2K (A0-A9,A11)
1 (S0,S2)
128MB
4K
4K (A0–A11)
32 Meg x 4
1 (S0,S2)
256MB
4K
MARKING
8K (A0-A12)
64 Meg x 4
-13E
-10E
-133
1 (S0,S2)
512MB
G
8K
168-PIN REGISTERED SDRAM DIMM
1
128MB, 256MB, 512MB (x72, ECC)
Table 2:
Table 3:
NOTE:
1. The designators for component and PCB revision
MT18LSDT1672G – 128MB,
MT18LSDT3272G – 256MB,
MT18LSDT6472G – 512MB
For the latest data sheet, please refer to the Micron
site:
MODULE
MARKING
MT18LSDT1672G-13E__
MT18LSDT1672G-133__
MT18LSDT1672G-10E__
MT18LSDT3272G-133__
MT18LSDT3272G-13E__
MT18LSDT3272G-10E__
MT18LSDT6472G-133__
MT18LSDT6472G-13E__
MT18LSDT6472G-10E__
Standard PCB
Low Profile PCB
are the last two characters of each part number.
Consult factory for current revision codes. Example:
MT18LSDT1672G-133B1
-13E
-133
-10E
Figure 1: 168-Pin DIMM (MO-168)
www.micron.com/moduleds
U1
PART NUMBER
Micron Technology, Inc., reserves the right to change products or specifications without notice.
U2
FREQUENCY
133 MHz
133 MHz
100 MHz
CLOCK
U3
Timing Parameters
Part Numbers
U4
CL = 2
ACCESS TIME
5.4ns
U5
9ns
16 Meg x 72
16 Meg x 72
16 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
U11
U10
U12
CONFIG
CL = 3
5.4ns
7.5ns
U6
©2003, Micron Technology Inc.
U7
SETUP
TIME
2ns
1.5
1.5
BUS SPEED
U8
SYSTEM
133 MHz
133 MHz
100 MHz
133 MHz
133 MHz
100 MHz
133 MHz
133 MHz
100 MHz
â
HOLD
TIME
U9
1ns
0.8
0.8
Web
U14

Related parts for MT18LSDT6472G-133D2

MT18LSDT6472G-133D2 Summary of contents

Page 1

... DDR SDRAM DIMMs (Footer Desc variable) SD18C16_32_64x72G_B.fm - Rev. B 1/03 EN 128MB, 256MB, 512MB (x72, ECC) 168-PIN REGISTERED SDRAM DIMM MT18LSDT1672G – 128MB, MT18LSDT3272G – 256MB, MT18LSDT6472G – 512MB For the latest data sheet, please refer to the Micron site: www.micron.com/moduleds Figure 1: 168-Pin DIMM (MO-168) Standard PCB ...

Page 2

... DQ55 V SS 153 DQ56 154 DQ57 155 DQ58 156 DQ59 157 V DD 158 DQ60 159 DQ61 160 DQ62 161 DQ63 162 V SS 163 DNU 164 NC 165 SA0 166 SA1 167 SA2 168 U14 PIN 84 U22 U23 PIN 85 ©2003, Micron Technology Inc. ...

Page 3

... Presence-Detect Address Inputs: These pins are used to configure the presence-detect device. REGE Input Register Enable. Input/ Data I/Os: Data bus. Output CB0-CB7 Input/ Check Bits. Output 3 DESCRIPTION Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2003, Micron Technology Inc. ...

Page 4

... V Supply Power Supply: +3.3V ±0.3V Supply Ground – Not Connected: These pins are not connected on these modules. 4 DESCRIPTION Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2003, Micron Technology Inc. ...

Page 5

... PLL SDRAM x 2 SDRAM x 2 12pF SDRAM x 2 SDRAM x 2 REGISTER x 3 CK1-CK3 12pF SDRAMS = MT48LC16M4A2TG for 128MB SDRAMS = MT48LC32M4A2TG for 256MB SDRAMS = MT48LC64M4A2TG for 512MB Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2003, Micron Technology Inc. ...

Page 6

... General Description The MT18LSDT1672G, MT18LSDT3272G, MT18LSDT6472G are high-speed CMOS, dynamic ran- dom-access, 128MB, 256MB, and 512MB memory modules organized in a x72 (ECC) configuration. These modules use internally configured quad-bank SDRAM devices, with a synchronous interface (all sig- nals are registered on the positive edge of clock signal CK0) ...

Page 7

... Full Page Reserved Burst Type M3 0 Sequential 1 Interleaved CAS Latency Reserved Reserved Reserved Reserved Reserved M8 M7 M6-M0 Operating Mode 0 0 Defined Standard Operation - - - All other states reserved Write Burst Mode Programmed Burst Length Single Location Access ©2003, Micron Technology Inc. ...

Page 8

... Register bit M3 is ignored. Micron Technology, Inc., reserves the right to change products or specifications without notice. 8 ORDER OF ACCESSES WITHIN A BURST TYPE = INTERLEAVED 0-1 0-1 1-0 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 Notsupported ©2003, Micron Technology Inc. ...

Page 9

... FREQUENCY (MHZ) SPEED £ 133 -13E £ 100 -133 £ 100 -10E Micron Technology, Inc., reserves the right to change products or specifications without notice NOP OUT NOP NOP OUT t AC DON’T CARE UNDEFINED £ 143 £ 133 NA ©2003, Micron Technology Inc. ...

Page 10

... L – – – – H Micron Technology, Inc., reserves the right to change products or specifications without notice. 10 SDRAM component ADDR DQS NOTES Bank/Row X 3 Bank/Col X 4 Bank/Col Valid 4 X Active Code Op-Code X 2 – Active 8 – High-Z 8 ©2003, Micron Technology Inc. ...

Page 11

... V -10 10 µ µA -10 10 µA 2.4 – V – 0.4 V MAX -13E -133 -10E UNITS 1,250 2,070 1,710 mA 3, 18, 19 810 810 630 mA 3, 12, 19, 2,700 2,520 2,160 mA 3, 18, 19, 4,140 3,780 3,420 mA 3, 12, 18, 19, 30 ©2003, Micron Technology Inc NOTES ...

Page 12

... MAX -133 -10E UNITS NOTES 2,250 2,250 mA 3, 18, 19 720 720 mA 3, 12, 19, 30 2,430 2,430 mA 3, 18, 19, 30 4,860 4,860 mA 3, 12, 18, 19, 30 ©2003, Micron Technology Inc. ...

Page 13

... Micron Technology, Inc., reserves the right to change products or specifications without notice. 13 MIN TYP MAX – 8 – – 4 – – 16 – – – 10 – 12 – 1 – 12 -133 -10E MAX MIN MAX UNITS 1.8 1 120,000 50 120,000 ©2003, Micron Technology Inc. UNITS NOTES ...

Page 14

... RDL t MRD CL=3 t ROH( ROH(2) Micron Technology, Inc., reserves the right to change products or specifications without notice. 14 -10E MIN MAX UNITS NOTES 20 ns 1.2 0.3 1 CLK 7ns -10E UNITS NOTES 15, 21 16 16 ©2003, Micron Technology Inc. ...

Page 15

... AC for -133/-13E with no load is 4.6ns t RAS. use in -13E speed grade module 45ns 7.5ns; for -13E and RFC (MIN) else CKE is LOW. The I Micron Technology, Inc., reserves the right to change products or specifications without notice 7.5ns for - under 7.5ns. 6 limit is DD ©2003, Micron Technology Inc. ...

Page 16

... Figure 7: Definition of Start and Stop SCL SDA DATA STABLE 16 START BIT 8 Acknowledge Micron Technology, Inc., reserves the right to change products or specifications without notice. STOP BIT 9 ©2003, Micron Technology Inc. ...

Page 17

... Similar to Current or Random Address Read Start, Device Select £ Start, Device Select HIGH LOW t HD:STA t HD:DAT CHIP ENABLE SA2 SA1 SA0 0 SA2 SA1 SA0 t SU:DAT t SU:STO Micron Technology, Inc., reserves the right to change products or specifications without notice BUF UNDEFINED ©2003, Micron Technology Inc. ...

Page 18

... SU:DAT 4.7 SU:STA 4.7 SU:STO t 10 WRC Micron Technology, Inc., reserves the right to change products or specifications without notice. UNITS 3 0 0 µA 10 µA 30 µ NOTES µs µ µs µs µs ns µs µs KHz ns µs µ ©2003, Micron Technology Inc. ...

Page 19

... Minimum RAS# Pulse Width, note 1) 31 Module Rank Density 16,32,Meg x 64 DDR SDRAM DIMMs (Footer Desc variable) SD18C16_32_64x72G_B.fm - Rev. B 1/03 EN 128MB, 256MB, 512MB (x72, ECC) 168-PIN REGISTERED SDRAM DIMM ENTRY (VERSION) MT18LSDT1672G MT18LSDT3272G MT18LSDT6472G 128 256 SDRAM 12or13 10or11 LVTTL 7 (-13E) 7 ...

Page 20

... The value of RAS used for the -13E module is calculated from 16,32,Meg x 64 DDR SDRAM DIMMs (Footer Desc variable) SD18C16_32_64x72G_B.fm - Rev. B 1/03 EN 128MB, 256MB, 512MB (x72, ECC) 168-PIN REGISTERED SDRAM DIMM ENTRY (VERSION) MT18LSDT1672G MT18LSDT3272G MT18LSDT6472G t 1.5 (-13E/-133 (-10E) 0.8 (--13E/133 (-10E) 1 ...

Page 21

... MIN Micron Technology, Inc., reserves the right to change products or specifications without notice. 21 1.705 (43.31) 1.695 (43.05) .700 (17.78) TYP. PIN 84 .050 (1.27) TYP. .128 (3.25) (2X) .118 (3.00) PIN 85 ©2003, Micron Technology Inc. .157 (4.00) MAX .054 (1.37) .046 (1.17) ...

Page 22

... U9 U8 1.206 (30.63) 1.194 (30.33) .700 (17.78) U14 PIN 84 .050 (1.27) U22 U23 .128 (3.25) (2X) .118 (3.00) PIN 85 Micron Technology, Inc., reserves the right to change products or specifications without notice. .320 (8.13) MAX .054 (1.37) .046 (1.17) ©2003, Micron Technology Inc. ...

Page 23

... E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc. 16,32,Meg x 64 DDR SDRAM DIMMs (Footer Desc variable) SD18C16_32_64x72G_B.fm - Rev. B 1/03 EN 128MB, 256MB, 512MB (x72, ECC) 168-PIN REGISTERED SDRAM DIMM ® 23 ©2003, Micron Technology Inc. ...

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