PC364N1J000F Sharp Microelectronics, PC364N1J000F Datasheet
PC364N1J000F
Specifications of PC364N1J000F
Related parts for PC364N1J000F
PC364N1J000F Summary of contents
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PC364NJ0000F Series ■ Description PC364NJ0000F Series contains an IRED optically coupled to a phototransistor. AC input and Low input current type packaged in a 4-pin mini-flat. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V and CTR is ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. SHARP mark "S" Primary side 3 64 mark 1 2 ±0.1 0.4 Epoxy resin Product mass : approx. 0.1g Plating material : SnCu (Cu : ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P ...
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... Model Line-up Taping Package 3 000 pcs / reel 750 pcs / reel PC364NJ0000F PC364NTJ000F Model No. PC364N1J000F PC364N1TJ00F Please contact a local SHARP sales representative to inquire about production status. I [mA] C Rank mark (I =±0.5mA, V =5V, T =25˚ with or without 0.25 to 2.0 A 0.5 to 1.5 5 PC364NJ0000F Series ...
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Fig.1 Test Circuit for Common Mode Rejection Voltae Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 250 200 ...
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Fig.6 Peak Forward Current vs. Duty Ratio Pulse width≤100µs T =25˚ 000 100 10 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current 500 400 300 200 100 0 0.1 1 Forward current I ...
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Fig.12 Collector Dark Current vs. Ambient Temperature − =50V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
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Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
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Package materials 2. 750 pcs / reel Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...