PC3H7AJ0000F Sharp Microelectronics, PC3H7AJ0000F Datasheet
PC3H7AJ0000F
Specifications of PC3H7AJ0000F
Related parts for PC3H7AJ0000F
PC3H7AJ0000F Summary of contents
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PC3H7J00000F Series ∗ 4-channel package type is also available. (model No. PC3Q67J0000F) ■ Description PC3H7J00000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat package, Half ptich type. Input-output isolation voltage(rms) is 2.5kV. ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions SHARP mark "S" Anode mark Date code ±0.2 4.4 ±0.3 5.3 (1.7) +0.4 0.5 −0.2 +0.2 7.0 −0 Reference Dimensions Product ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Taping Package 3 000pcs/reel DIN EN60747-5-2 - PC3H7J00000F PC3H7YJ0000F PC3H7AJ0000F PC3H7Y1J000F PC3H7BJ0000F PC3H7Y2J000F PC3H7CJ0000F PC3H7Y3J000F PC3H7DJ0000F PC3H7Y4J000F PC3H7ABJ000F PC3H7Y5J000F Model No. PC3H7BCJ000F PC3H7Y6J000F PC3H7CDJ000F PC3H7Y7J000F PC3H7ACJ000F PC3H7Y8J000F PC3H7BDJ000F PC3H7Y9J000F PC3H7ADJ000F PC3H7Y0J000F Please contact a local SHARP sales representative to inquire about production status. ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Current Transfer Ratio vs. Forward Current 500 400 300 200 100 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 I =1mA,V F 100 50 0 − −40 Ambient ...
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Fig.13 Test Circuit for Response Time Input Output Output Input Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph ...
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Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 12.0 H ±0.1 7.5 Reel structure and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...