PC452TJ0000F Sharp Microelectronics, PC452TJ0000F Datasheet
PC452TJ0000F
Specifications of PC452TJ0000F
PC452TJ0000F
Related parts for PC452TJ0000F
PC452TJ0000F Summary of contents
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PC452J00000F Series ■ Description PC452J00000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 350V and CTR is MIN. 1 000% at input current of ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. SHARP mark PC452 "s" Anode mark ±0 0.4 Factory identification mark Epoxy resin Product mass : approx. 0.1g Anode 1 4 Cathode 2 ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current I F Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P tot Operating ...
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... Model Line-up Taping Package 3 000 pcs/reel 750 pcs/reel Model No. PC452J00000F PC452TJ0000F Please contact a local SHARP sales representative to inquire about production status. PC452J00000F Series 5 Sheet No.: D2-A00902EN ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Peak Forward Current vs. Duty Ratio 10 000 Pulse width≤100µ 000 100 10 −3 − ...
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Fig.7 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.9 Collector Dark Current vs. Ambient Temperature − =200V CE −6 10 −7 10 −8 10 −9 10 −10 ...
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Fig.13 Collector-emitter Saturation Voltage vs. Forward Current 5 Ic=5mA 10mA 4 30mA 50mA 3 70mA 100mA Forward current I F Remarks : Please be aware that all data in the graph are just ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
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Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...