IDT88P8341BHI IDT, Integrated Device Technology Inc, IDT88P8341BHI Datasheet - Page 92

• Manufacturer Part Number: IDT88P8341BHI
• Description: IC SPI3-SPI4 EXCHANGE 820-PBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT88P8341BHI

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 88P8341BHI

IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIAL TEMPERATURE RANGE
12.3 Device package
The SPI Exchange IDT88P8341 device is packaged in a 35 mm by 35 mm
820-ball one millimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 41. IDT88P8341 820PBGA package, bottom view
APRIL 10, 2006
92