MAX15021ATI+ Maxim Integrated Products, MAX15021ATI+ Datasheet - Page 20

• Manufacturer Part Number: MAX15021ATI+
• Description: IC REG SYNC DUAL 28-TQFN-EP
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck)r

Specifications of MAX15021ATI+

• Internal Switch(s): Both
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.6 ~ 5.5 V
• Current - Output: 2A, 4A
• Frequency - Switching: 500kHz ~ 4MHz
• Voltage - Input: 2.5 ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-TQFN Exposed Pad
• Power - Output: 2.76W
• Topology: Buck
• Output Voltage: 0.6 V to 5.5 V
• Output Current: 2 A, 4 A
• Input Voltage: 2.5 V to 5.5 V
• Duty Cycle (max): 100 %
• Switching Frequency: 500 KHz to 4 MHz
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Careful PCB layout is critical to achieve clean and sta-
ble operation. Follow these guidelines for good PCB
layout:
1) Place decoupling capacitors as close as possible to
2) Keep SGND and PGND isolated and connect them
3) Route high-speed switching nodes away from sensi-
4) Distribute the power components evenly across the
5) Ensure timing resistor and all feedback connections
Dual, 4A/2A, 4MHz, Step-Down DC-DC
Regulator with Tracking/Sequencing Capability
20
the IC pins.
at one single point close to the negative terminal of
the input filter capacitor.
tive analog areas (FB_, COMP_, and EN_).
board for proper heat dissipation.
are short and direct. Place feedback resistors as
close as possible to the IC.
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Applications Information
PCB Layout Guidelines
6) Place the bank of the output capacitors close to the
7) Connect the MAX15021 exposed pad to a large
8) Use 2oz. copper to keep trace inductance and
9) A reference PCB layout included in the MAX15021
load.
copper plane to maximize its power dissipation
capability. Connect the exposed pad to SGND
plane. Do not connect the exposed pad to the
SGND pin directly underneath the IC.
resistance to a minimum. Thin copper PCBs can
compromise efficiency since high currents are
involved in the application. Also thicker copper con-
ducts heat more effectively, thereby reducing ther-
mal impedance.
Evaluation Kit is also provided to further aid layout.