GNM314R72A102KD01D Murata Electronics North America, GNM314R72A102KD01D Datasheet - Page 85

CAP 4-ARRAY 1000PF 100V X7R 1206

GNM314R72A102KD01D

Manufacturer Part Number
GNM314R72A102KD01D
Description
CAP 4-ARRAY 1000PF 100V X7R 1206
Manufacturer
Murata Electronics North America
Series
GNMr
Datasheet

Specifications of GNM314R72A102KD01D

Capacitance
1000pF
Voltage - Rated
100V
Dielectric Material
Ceramic
Number Of Capacitors
4
Circuit Type
Isolated
Temperature Coefficient
X7R
Tolerance
±10%
Mounting Type
Surface Mount
Package / Case
1206 (3216 Metric)
Height
0.031" (0.80mm)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-3421-2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Mounting Position
2. Chip Placing
!Caution (Soldering and Mounting)
Choose a mounting position that minimizes the stress
An excessively low bottom dead point of the suction
Dirt particles and dust accumulated between the suction
imposed on the chip during flexing or bending of the
board.
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
(Reference Data 2. Board bending strength for solder fillet height)
(Reference Data 3. Temperature cycling for solder fillet height)
(Reference Data 4. Board bending strength for board material)
(Reference Data 5. Break strength)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
[Component Direction]
[Chip Mounting Close to Board Separation Point]
[Incorrect]
[Correct]
Perforation
Suction Nozzle
Board
A
Slit
B
Support Pin
D
C
Deflection
Continued on the following page.
Chip arrangement
Worst A-C-(B~D) Best
!Caution
Locate chip
horizontal to the
direction in
which stress
acts
Board Guide
C02E.pdf
83
07.2.6
13

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