GNM314R72A102KD01D Murata Electronics North America, GNM314R72A102KD01D Datasheet - Page 143

• Manufacturer Part Number: GNM314R72A102KD01D
• Description: CAP 4-ARRAY 1000PF 100V X7R 1206
• Manufacturer: Murata Electronics North America
• Series: GNMr

Specifications of GNM314R72A102KD01D

• Capacitance: 1000pF
• Voltage - Rated: 100V
• Dielectric Material: Ceramic
• Number Of Capacitors: 4
• Circuit Type: Isolated
• Temperature Coefficient: X7R
• Tolerance: ±10%
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric)
• Height: 0.031" (0.80mm)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 490-3421-2

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
3. Land Layout for Cropping PC Board
[Component Direction]
Caution (Soldering and Mounting)
Do not expose a capacitor to excessive shock or vibration
during use.
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Locate chip
horizontal to the
direction in which
stress acts.
2. Circuit Board Material
[Chip Mounting Close to Board Separation Point]
In case that ceramic chip capacitor is soldered on the
metal board, such as Aluminum board, the stress of heat
expansion and contraction might cause the crack of
ceramic capacitor, due to the difference of thermal
expansion coefficient between metal board and ceramic
chip.
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
!Caution
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