SE98ATP,147 NXP Semiconductors, SE98ATP,147 Datasheet - Page 39
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SE98ATP,147
Manufacturer Part Number
SE98ATP,147
Description
IC TEMPERATURE SENSOR DDR 8HWSON
Manufacturer
NXP Semiconductors
Datasheet
1.SE98ATP547.pdf
(43 pages)
Specifications of SE98ATP,147
Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
1.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-WSON
Full Temp Accuracy
+/- 2 C
Digital Output - Bus Interface
2-Wire
Digital Output - Number Of Bits
11
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.7 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Current
250 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
SE98A_4
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
29
Rev. 04 — 25 November 2009
31.
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
DDR memory module temp sensor, 1.7 V to 3.6 V
3
3
)
)
Figure
350 to 2000
260
250
245
31) than a SnPb process, thus
≥ 350
220
220
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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