SE98ATP,147 NXP Semiconductors, SE98ATP,147 Datasheet - Page 30
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SE98ATP,147
Manufacturer Part Number
SE98ATP,147
Description
IC TEMPERATURE SENSOR DDR 8HWSON
Manufacturer
NXP Semiconductors
Datasheet
1.SE98ATP547.pdf
(43 pages)
Specifications of SE98ATP,147
Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
1.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-WSON
Full Temp Accuracy
+/- 2 C
Digital Output - Bus Interface
2-Wire
Digital Output - Number Of Bits
11
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.7 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Current
250 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
Table 26.
V
[1]
SE98A_4
Product data sheet
Symbol
V
V
V
V
V
I
I
I
I
I
C
OL(sink)EVENT
OL(sink)(SDA)
LOH
LIH
LIL
DD
Fig 16. Average supply current
IH
IL
I(ov)
th(POR)H
th(rec)POR
i
I
High-voltage input voltage applied to pin A0 during RWP and CRWP operations of the equivalent SPD-included parts. The JEDEC
specification is 7 V (min.) and 10 V (max.). When V
8.4 V.
= 1.7 V to 3.6 V; T
DD(AV)
(μA)
a. I
350
250
150
50
−50
2
V
SMBus DC characteristics
C-bus inactive
DD
−25
= 3.6 V
Parameter
HIGH-level input voltage
LOW-level input voltage
overvoltage input voltage
HIGH-level power-on reset
threshold voltage
power-on reset recovery
threshold voltage
LOW-level output sink current on
pin EVENT
LOW-level output sink current on
pin SDA
HIGH-level output leakage current
HIGH-level input leakage current
LOW-level input leakage current
input capacitance
3.0 V
2.3 V
1.7 V
0
amb
=
25
−
20
50
°
C to +120
75
T
amb
002aae374
100
°
C; unless otherwise specified. These specifications are guaranteed by design.
(°C)
Rev. 04 — 25 November 2009
125
DD
is 3.6 V, then V
Conditions
SCL, SDA;
V
SCL, SDA;
V
pin A0;
V
for device reset
V
V
V
pins SCL, SDA;
V
pins SCL, SDA;
V
SCL, SDA pins
DD
DD
I(ov)
OL
OL
OH
I
I
= V
= V
= 0.4 V
= 0.5 V
= 1.7 V to 3.6 V
= 1.7 V to 3.6 V
= V
− V
DD
DD
DD
DD
or V
or V
I(ov)
DDR memory module temp sensor, 1.7 V to 3.6 V
I
DD(AV)
> 4.8 V
(μA)
SS
SS
b. I
350
250
150
> 4.8 V + V
50
−50
2
V
C-bus active
DD
−25
= 3.6 V
3.0 V
2.3 V
1.7 V
DD
[1]
or > 4.8 V + 3.6 V then the minimum voltage is
Min
0.7V
-
7.0
-
-
6
3
-
−1.0
−1.0
-
0
DD
25
Typ
-
-
-
-
-
-
-
-
-
5
-
50
75
© NXP B.V. 2009. All rights reserved.
T
amb
Max
V
0.3V
10
1.7
-
-
1.0
+1.0
+1.0
10
002aae375
0.5
100
DD
SE98A
(°C)
+ 1
DD
125
Unit
V
V
V
V
V
mA
mA
μA
μA
μA
pF
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