UBA2025T/N1,518 NXP Semiconductors, UBA2025T/N1,518 Datasheet

IC DRIVER HALF BRIDGE 16-SOIC

UBA2025T/N1,518

Manufacturer Part Number
UBA2025T/N1,518
Description
IC DRIVER HALF BRIDGE 16-SOIC
Manufacturer
NXP Semiconductors
Type
CFL/TL Driverr
Datasheets

Specifications of UBA2025T/N1,518

Package / Case
16-SOIC (0.300", 7.5mm Width)
Frequency
42.21 ~ 44.59 kHz
Current - Supply
1.6mA
Current - Output
1.5A
Operating Temperature
-40°C ~ 150°C
Driver Type
CFL Drivers
Operating Supply Voltage
600 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Maximum Output Current
1.5 A
Minimum Operating Temperature
- 40 C
Supply Current
1.6 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4923-2
935287838518
1. General description
2. Features
3. Applications
4. Ordering information
Table 1.
Type number
UBA2025T
Ordering information
Package
Name
SO16L
The UBA2025 is a high voltage power IC intended to drive and control a Compact
Fluorescent Lamp (CFL). It contains a half bridge power circuit, an oscillator, and a control
circuit for starting up, preheating, ignition, lamp burning, and protection.
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UBA2025
CFL power IC
Rev. 01 — 16 October 2009
Two internal 600 V, 3
For steady state half bridge currents up to 280 mA
For ignition half bridge currents up to 1.5 A
Adjustable preheat and ignition time
Adjustable preheat current
Adjustable lamp power
Lamp temperature stress protection at higher mains voltages
Capacitive mode protection
Protection against too low a drive voltage for the power MOSFETs.
5 W to 25 W CFLs provided that the maximum junction temperature is not exceeded.
Description
plastic small outline package; 16 leads; body width 7.5 mm
max NMOST half bridge powers
Product data sheet
Version
SOT162-1

Related parts for UBA2025T/N1,518

UBA2025T/N1,518 Summary of contents

Page 1

UBA2025 CFL power IC Rev. 01 — 16 October 2009 1. General description The UBA2025 is a high voltage power IC intended to drive and control a Compact Fluorescent Lamp (CFL). It contains a half bridge power circuit, an oscillator, ...

Page 2

... NXP Semiconductors 5. Block diagram VS RHV 6 14 SUPPLY BANDGAP REFERENCE 9 CPAV SHUNT 10 RS CURRENT MONITOR Fig 1. Block diagram UBA2025_1 Product data sheet IREF BOOTSTRAP LEVEL OSCILLATOR SHIFTER NON TIMING OVERLAP CONTROL 12 SGND Rev. 01 — 16 October 2009 UBA2025 CFL power VDC HS DRIVER 4 S1A ...

Page 3

... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 2. Symbol PGND GLI S1B S1A FS VS GLO GND CPAV RS IREF SGND CF RHV CI VDC UBA2025_1 Product data sheet 1 PGND GLI 2 S1B 3 4 S1A GLO 7 8 GND Pin assignment Pin description Pin ...

Page 4

... NXP Semiconductors 7. Functional description 7.1 Introduction The integrated circuit for electronically ballasted compact fluorescent lamps and its derivatives nominal mains voltage of 230 V (RMS). It provides all the necessary functions for proper preheat, ignition and on-state operation of the lamp. Besides the control function, the IC provides the level shift and drive for the two internal power MOSFETs ...

Page 5

... NXP Semiconductors capacitor connected to pin CI. The frequency during preheating will be approximately 90 kHz. This frequency is well above the resonant frequency of the load, which means that the lamp is off. The load consists of L2, C5 and the electrode resistance only (see Figure The circuit can be locked in the preheat state by connecting pin CPAV to ground. During ...

Page 6

... NXP Semiconductors 7.8 Feed forward frequency Above a defined voltage level at pin VDC the oscillation frequency also depends on the supply voltage of the half bridge (see oscillator is in this feed forward range and is derived from the current through R similar to pin RHV current). The feed forward frequency is proportional to the average value of the current (within its operating range) through R is clamped for currents beyond the operating range (i ...

Page 7

... NXP Semiconductors Table 3. Frequency < 75 kHz 75 kHz to 80 kHz > 85 kHz The drive voltage at gate of T2 (G2) will exceed the drive voltage of the high side driver. 7.12 Frequency and change in frequency At any point in time during oscillation, the circuit will operate between f change in frequency will be gradual, no steps in frequency will occur. Changes in frequency caused by a change in voltage at pin CI, show a rather constant df/dt over the entire frequency range ...

Page 8

... NXP Semiconductors 8. Limiting values Table 4. Limiting values Symbol Parameter V input voltage on pin VDC operating i(VDC) V voltage on pin clamp current clamp I drain current D V input voltage I SR slew rate T ambient temperature amb T junction temperature j T storage temperature stg Q coupling charge coup V electrostatic discharge ...

Page 9

... NXP Semiconductors 10. Characteristics Table 6. Characteristics voltage on pin amb PGND; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter High voltage supply I leakage current leak Start-up state V reset voltage rst V start-up voltage startup V stop voltage stop V hysteresis voltage ...

Page 10

... NXP Semiconductors Table 6. Characteristics …continued voltage on pin amb PGND; currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter R /R on-state resistance ratio on(150) on(25) (150 bootstrap diode forward Fd(bs) voltage feed forward R input resistance on pin i(RHV) RHV ...

Page 11

... NXP Semiconductors 11. Application information 11.1 Design equations • Bottom frequency: f btm • Feed forward frequency Where: – 3.68 – 22.28 – 0.4 s – R – C – V – V – R • Operating frequency = f Where: – f – f – f • Preheat time • Ignition time: t ign • ...

Page 12

... NXP Semiconductors 11.2 Application diagram 230 Fig CFL application diagram Table CFL application component values Component type Component name diodes DS1-DS4 DS7, DS8 resistors R1 R IREF SHUNT inductors L1 L2 capacitors C2 C3 CPAV CF C BOOT CS7 UBA2025_1 Product data sheet C3 L2 LAMP ...

Page 13

... NXP Semiconductors Table CFL application component values Component type Component name capacitor CS9 CFL E27 CFL IC UBA2025T UBA2025_1 Product data sheet Value Description 100 nF decoupling 23 W CFL E27 type SO16L, SOT162-1 control IC with integrated power MOSFETs Rev. 01 — 16 October 2009 UBA2025 CFL power IC © ...

Page 14

... NXP Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

Page 15

... NXP Semiconductors 13. Abbreviations Table 8. Abbreviations Acronym Description CFL Compact Fluorescent Lamp NMOST Negative Channel Metal-Oxide Semiconductor MOSFET Metal-Oxide-Semiconductor Field-Effect Transistors LS Low Side 14. Revision history Table 9. Revision history Document ID Release date UBA2025_1 20091016 UBA2025_1 Product data sheet Data sheet status Change notice ...

Page 16

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 17

... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Initial start- 7.3 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.4 Operation in preheat mode . . . . . . . . . . . . . . . . 4 7.5 Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.6 Failure to ignite ...

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