SI3500-A-GM Silicon Laboratories Inc, SI3500-A-GM Datasheet - Page 15

• Manufacturer Part Number: SI3500-A-GM
• Description: IC POE SWITCH PWR OVER LAN 20QFN
• Manufacturer: Silicon Laboratories Inc
• Type: Power over Ethernet Switch (PoE)r

Specifications of SI3500-A-GM

• Package / Case: 20-QFN
• Applications: IP Phones, Power over LAN, Network Routers and Switches
• Internal Switch(s): Yes
• Current Limit: 525mA
• Voltage - Supply: 42 V ~ 57 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 10 C
• Mounting Style: SMD/SMT
• Product: Ethernet Controllers
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 336-1844-5

General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 1.2 mm square openings on 1.4 mm pitch should be used for the center
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification
Symbol
solder mask and the metal pad is to be 60 m minimum, all the way around the pad.
used to assure good solder paste release.
ground pad.
for Small Body Components.
P1
P2
X1
Y1
C1
C2
E
Table 10. PCB Land Pattern Dimensions
2.70
2.70
0.25
0.90
Min
Rev. 1.1
Nom
2.75
2.75
0.30
0.95
4.70
4.70
0.80
Max
2.80
2.80
0.35
1.00
Si3500
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