TNY377PN Power Integrations, TNY377PN Datasheet - Page 20

IC OFFLINE SWIT OVP OTP HV 8DIP

TNY377PN

Manufacturer Part Number
TNY377PN
Description
IC OFFLINE SWIT OVP OTP HV 8DIP
Manufacturer
Power Integrations
Series
TinySwitch®-PKr
Type
Off Line Switcherr
Datasheet

Specifications of TNY377PN

Output Isolation
Isolated
Frequency Range
132 ~ 280kHz
Voltage - Output
700V
Power (watts)
28W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage
700 V
Input / Supply Voltage (max)
9 V
Input / Supply Voltage (min)
- 0.3 V
Duty Cycle (max)
65 %
Switching Frequency
264 KHz
Supply Current
570 uA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
Through Hole
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Output Current
1.4 A
Output Power
28 W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
596-1144-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TNY377PN
Manufacturer:
POWER
Quantity:
15 000
Rev. C 07/09
.240 (6.10)
.260 (6.60)
.125 (3.18)
.145 (3.68)
20
-T-
.100 (2.54) BSC
.032 (.81)
.037 (.94)
Pin 1
-D-
-E-
.125 (3.18)
.145 (3.68)
.240 (6.10)
.260 (6.60)
SEATING
PLANE
-E-
Pin 1
-D-
TNY375-380
.014 (.36)
.022 (.56)
.367 (9.32)
.387 (9.83)
D S .004 (.10)
.100 (2.54) (BSC)
D S .004 (.10)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
.048 (1.22)
.053 (1.35)
T E D S .010 (.25) M
.137 (3.48)
.009 (.23)
MINIMUM
E S
.057 (1.45)
.068 (1.73)
.057 (1.45)
.068 (1.73)
.372 (9.45)
.388 (9.86)
.120 (3.05)
.140 (3.56)
.137 (3.48)
(NOTE 5)
MINIMUM
MINIMUM
(NOTE 6)
.015 (.38)
.010 (.25)
SMD-8C
DIP-8C
.004 (.10)
.012 (.30)
Pin 1
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Solder Pad Dimensions
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
.046 .060
.086
.004 (.10)
.008 (.20)
.015 (.38)
.186
.286
.300 (7.62) BSC
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
(NOTE 7)
.060 .046
.080
.420
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
www.powerint.com
PI-4015-013106
PI-3933-100504
G08C
P08C

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