CY7C1383C-100AC Cypress Semiconductor Corp, CY7C1383C-100AC Datasheet
CY7C1383C-100AC
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CY7C1383C-100AC Summary of contents
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... TQFP and 165 fBGA package only. 119 BGA is offered only in 1 Chip Enable Cypress Semiconductor Corporation Document #: 38-05238 Rev. *B Functional Description The CY7C1381C/CY7C1383C is a 3.3V, 512K x 36 and Synchronous Flowthrough SRAMs, respectively designed to interface with high-speed microprocessors with minimum ) DD glue logic. Maximum access delay from clock rise is 6.5 ns (133-MHz version) ...
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... CLK C DQ DQP , A CEN BW A BYTE BWE WRITE REGISTER GW ENABLE CE1 REGISTER CE2 CE3 OE ADV/LD SLEEP ZZ CONTROL Logic Block Diagram – CY7C1383C (1M x 18) ADDRESS A0,A1,A REGISTER WE MODE ADV CLK OE CE1 CE2 ADSC CE3 ADSP ZZ DQ ,DQP B B WRITE REGISTER ,DQP WRITE REGISTER ...
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... TQFP Pinout DQP DDQ 4 DDQ SSQ 5 SSQ SSQ 10 SSQ DDQ 11 DDQ /DNU DDQ 20 DDQ SSQ 21 SSQ DQP SSQ 26 SSQ DDQ 27 DDQ DQP CY7C1381C CY7C1383C DDQ V 76 SSQ NC 75 DQP SSQ V 70 DDQ CY7C1383C ( DDQ V 60 SSQ SSQ V 54 DDQ Page ...
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... DDQ Document #: 38-05238 Rev. *B 119-ball BGA (1 Chip Enable with JTAG) CY7C1381C (512K x 36 ADSP A A ADSC DQP ADV CLK BWE DQP MODE TMS TDI TCK CY7C1383C ( ADSP A A ADSC ADV CLK BWE DQP MODE TMS TDI TCK CY7C1381C CY7C1383C DDQ ...
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... V B DDQ DDQ DDQ DDQ DDQ N DQP DDQ 72M A R MODE NC / 36M A Document #: 38-05238 Rev. *B 165-ball fBGA (3 Chip Enable) CY7C1381C (512K x 36 CLK TDI TMS CY7C1383C ( CLK TDI TMS CY7C1381C CY7C1383C BWE ADSC ADV ADSP DDQ DDQ DDQ DDQ DDQ B ...
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... Synchronous F4 B8 Input- Asynchronous G4 A9 Input- Synchronous A4 B9 Input- Synchronous CY7C1381C CY7C1383C Description Address Inputs used to select one of the 512K address locations. Sampled at the rising edge of the CLK if ADSP or ADSC is [2] active LOW, and and sampled active. A feed the 2-bit counter. ...
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... Power Supply Power supply inputs to the core of the E8,F4,F8, G4,G8,H4, H8,J4,J8, K4,K8,L4, L8,M4,M8 CY7C1381C CY7C1383C Description Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When asserted LOW, addresses presented to the device are captured in the address registers. A are also loaded into the burst [1:0] counter ...
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... H10,N2,N5,N7, N10,P1,P2, Ground/DNU This pin can be connected to Ground or CY7C1381C CY7C1383C Description Power supply for the I/O circuitry. Ground for the core of the device. Ground for the I/O circuitry. Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is not being utilized, this pin should be left unconnected ...
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... CY7C1383C:Pin Definitions TQFP BGA (3-Chip (1-Chip Name Enable) Enable 37,36,32,33,34, P4,N4,A2,B2 35,42,43,44,45, C2,R2,T2,A3, 46,47,48,49,50, B3,C3,T3,A5, 80,81,82,99,100 B5,C5,T5,A6, B6,C6,R6,T6 93,94 L5, BWE CLK [ ADV Document #: 38-05238 Rev. *B fBGA (3-Chip Enable) I/O R6,P6,A2, Input- A10,A11,B2, Synchronous B10,N6,P3,P4, P8,P9,P10, P11,R3,R4, R8,R9,R10,R11 B5,A4 Input- Synchronous H4 B7 ...
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... CY7C1383C:Pin Definitions (continued) TQFP BGA (3-Chip (1-Chip Name Enable) Enable) 84 ADSP 85 ADSC ZZ 64 58,59,62,63,68, P7,K7,G7,E7, 69,72,73,8,9,12, ,H6,L6,N6,D1,H 13, 1,L1,N1,E2,G2, 18,19,22,23 K2,M2 74,24 D6,P2 DQP [A:B] MODE 31 Document #: 38-05238 Rev. *B fBGA (3-Chip Enable) I Input- Synchronous B4 A8 Input- Synchronous T7 H11 Input- Asynchronous J10,K10, I/O- ...
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... CY7C1383C:Pin Definitions (continued) TQFP BGA (3-Chip (1-Chip Name Enable) Enable) V 15,41,65,91 C4,J2,J4,J6, 4,11,20,27, A1,A7,F1,F7,J1, DDQ 54,61,70,77 J7,M1,M7,U1,U V 17,40,67,90 D3,D5,E3,E5,F3 SS ,F5,G5,H3, H5,K3,K5,L3,M3 M5,N3, N5,P3,P5 V 5,10,21,26, SSQ 55,60,71,76, TDO - TDI - TMS - TCK - Document #: 38-05238 Rev. *B fBGA (3-Chip Enable) I/O D4,D8,E4, Power Supply Power supply inputs to the core of the ...
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... CY7C1383C:Pin Definitions (continued) TQFP BGA (3-Chip (1-Chip Name Enable) Enable) NC 1,2,3,6,7,16,25, B1,B7,C1,C7,D 28,29,30,38,39, 2,D4,D7,E1,E6, 51,52,53,56,57, H2,F2,G1,G6,H 66,75,78,79,95, 7,J3,J5,K1,K6,L 96 4,L2,L7,M6,N2, N7,L7,P1,P6,R1 ,R5,R7,T1,T4,U V /DNU 14 SS Document #: 38-05238 Rev. *B fBGA (3-Chip Enable) I/O A1,A5,B1, - B4,B11,C1,C2,C 10,D1,D10,E1,E 10,F1,F10,G1,G 10,H3,H9,H10,J 2,J11,K2,K11, L2,L11,M2,M11, 6 N2,N5,N7,N10, N11,P1,P2, Ground/DNU CY7C1381C ...
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... Maximum access delay from the clock rise ( 6.5 ns (133-MHz device). C0 The CY7C1381C/CY7C1383C supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium processors. The linear burst sequence is suited for processors that utilize a linear burst sequence ...
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... ADSP ADSC CY7C1381C CY7C1383C Min. Max. Unit CYC 2t ns CYC 2t ns CYC 0 ns ADV WRITE OE CLK L-H Tri-State L-H Tri-State L-H Tri-State L-H Tri-State L-H Tri-State Tri-State L L-H Tri-State L L L-H Tri-State L L-H Tri-State . Writes may occur only on subsequent clocks X Page ...
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... B A, DQP , DQP ) B A Write All Bytes Write All Bytes Note: 8. Table only lists a partial listing of the byte write combinations. Any Combination of BW Truth Table for Read/Write [3] Function (CY7C1383C) Read Read Write Byte and DQP ) A A Write Byte and DQP ) B B Write All Bytes Document #: 38-05238 Rev ...
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... Truth Table for Read/Write [3] Function (CY7C1383C) Write All Bytes Document #: 38-05238 Rev BWE L X CY7C1381C CY7C1383C Page ...
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... IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1381C/CY7C1383C incorporates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM ...
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... TAP controller’s capture setup plus hold time (t plus The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a portion of SAMPLE/PRELOAD instruction. If this is an issue still CY7C1381C CY7C1383C Unlike the SAMPLE/PRELOAD ). Page ...
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... Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. TAP Timing CYC TL t TMSS t TMSH t TDIS t TDIH DON’T CARE /t = 1ns R F CY7C1381C CY7C1383C TDOV t TDOX UNDEFINED [9, 10] Symbol Min Max t 100 TCYC ...
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... OL DDQ DDQ I = 100 µ 3.3V OL DDQ V = 2.5V DDQ V = 3.3V DDQ V = 2.5V DDQ V = 3.3V DDQ V = 2.5V DDQ GND < V < DDQ CY7C1381C CY7C1383C V to 2.5V SS 1.25V 20pF O MIN MAX UNITS 2.4 V 2.0 V 2.9 V 2.1 V 0.4 V 0.4 V 0.2 V 0 0.3 ...
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... Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. CY7C1381C CY7C1383C DESCRIPTION Describes the version number. Reserved for Internal Use Defines memory type and architecture Defines width and density Allows unique identification of SRAM vendor ...
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... BGA Boundary Scan Order CY7C1381C (512K x 36) BIT BALL Document #: 38-05238 Rev. *B BIT BALL Not Bonded (Preset Internal Internal CY7C1381C CY7C1383C Page ...
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... BGA Boundary Scan Order CY7C1383C (1M x 18) BIT BALL Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Document #: 38-05238 Rev. *B BIT BALL Not Bonded (Preset to 0) ...
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... BIT# BALL B10 9 A10 10 C11 11 E10 12 F10 13 G10 14 D10 15 D11 16 E11 17 F11 18 G11 19 H11 20 J10 21 K10 22 L10 23 M10 24 J11 25 K11 26 L11 27 M11 28 N11 29 R11 30 R10 P10 P11 Document #: 38-05238 Rev. *B CY7C1381C (512K x 36) BIT# BALL Not Bonded (Preset CY7C1381C CY7C1383C Page ...
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... Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset R11 30 R10 P10 P11 Document #: 38-05238 Rev. *B CY7C1383C (1M x 18) BIT# BALL Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset Not Bonded (Preset to 0) ...
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... inputs static /2), undershoot: V (AC) > -2V (Pulse width less than t CYC IL (min.) within 200ms. During this time V < CY7C1381C CY7C1383C Ambient Temperature V DD 0°C to +70°C 3.3V – 5%/+10% 2.5V – 5% -40°C to +85°C Min. Max. 3.135 3.6 3.135 ...
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... T = 25° MHz 3.3V 2.5V DDQ R = 317Ω 3.3V OUTPUT 351Ω INCLUDING JIG AND (b) SCOPE R = 1667Ω 2.5V OUTPUT =1538Ω INCLUDING JIG AND (b) SCOPE CY7C1381C CY7C1383C TQFP BGA fBGA Package Package Package TQFP BGA fBGA Package Package Package ALL INPUT PULSES ...
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... V POWER is less than t and t is less than t to eliminate bus contention between SRAMs when sharing the same OELZ CHZ CLZ = 2.5V. DDQ CY7C1381C CY7C1383C 117 MHz 100 MHz Min. Max. Min. Max 8.5 10 2.3 2 ...
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... Data Out (Q) High-Z t CDV Single READ Document #: 38-05238 Rev ADS t ADH ADVH ADVS ADV suspends burst t CDV t OELZ t OEHZ t DOH Q(A2 DON’T CARE CY7C1381C CY7C1383C Deselect Cycle Q( Q(A2) Q( Burst wraps around to its initial state BURST READ UNDEFINED Page CHZ Q( ...
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... OEHZ Data Out (Q) BURST READ Single WRITE Document #: 38-05238 Rev. *B ADSC extends burst WEH WES ADV suspends burst D(A2 BURST WRITE DON’T CARE UNDEFINED CY7C1381C CY7C1383C t ADS t ADH A3 t WES t WEH t ADVS t ADVH D( D(A3 Extended BURST WRITE Page ...
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... DQs are in high-Z when exiting ZZ sleep mode. Document #: 38-05238 Rev WES WEH OELZ D(A3) t OEHZ t CDV Q(A4) Single WRITE DON’T CARE is HIGH and CE is LOW. When CE is HIGH LOW. X CY7C1381C CY7C1383C A5 D(A5) Q(A4+1) Q(A4+2) Q(A4+3) Back-to-Back BURST READ WRITEs UNDEFINED is HIGH LOW HIGH Page D(A6) ...
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... CY7C1381C-133AC CY7C1383C-133AC CY7C1381C-133BGC CY7C1383C-133BGC CY7C1381C-133BZC CY7C1383C-133BZC 117 CY7C1381C-117AC CY7C1383C-117AC CY7C1381C-117BGC CY7C1383C-117BGC CY7C1381C-117BZC CY7C1383C-117BZC CY7C1381C-117AI CY7C1383C-117AI CY7C1381C-117BGI CY7C1383C-117BGI CY7C1381C-117BZI CY7C1383C-117BZI Document #: 38-05238 Rev ZZI I DDZZ High-Z DON’T CARE Package Name Part and Package Type A101 100-lead Thin Quad Flat Pack ( 1.4mm) ...
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... Ordering Information Speed (MHz) Ordering Code 100 CY7C1381C-100AC CY7C1383C-100AC CY7C1381C-100BGC CY7C1383C-100BGC CY7C1381C-100BZC CY7C1383C-100BZC CY7C1381C-100AI CY7C1383C-100AI CY7C1381C-100BGI CY7C1383C-100BGI CY7C1381C-100BZI CY7C1383C-100BZI Shaded areas contain advance information. Please contact your local sales representative for availability of these parts. Package Diagrams 100-Pin Thin Plastic Quad Flatpack ( 1.4 mm) A101 16.00± ...
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... Package Diagrams (continued) Document #: 38-05238 Rev. *B CY7C1381C CY7C1383C 51-85115-*B Page ...
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... Intel and Pentium are registered trademarks of Intel Corporation. PowerPC is a trademark of IBM Corporation. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05238 Rev. *B 165-Ball FBGA ( 1.2 mm) BB165A CY7C1381C CY7C1383C 51-85122-*C Page ...
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... Document History Page Document Title: CY7C1381C/CY7C1383C 18-Mb (512K x 36/1M x 18) Flow-Through SRAM Document Number: 38-05238 REV. ECN NO. Issue Date ** 116278 08/27/02 *A 121541 11/21/02 *B 206081 See ECN Document #: 38-05238 Rev. *B Orig. of Change Description of Change SKX New Data Sheet DSG Updated package diagrams 51-85115 (BG119) to rev. *B and 51-85122 (BB165A) to rev ...