PESD3V3V4UW T/R NXP Semiconductors, PESD3V3V4UW T/R Datasheet - Page 13

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PESD3V3V4UW T/R

Manufacturer Part Number
PESD3V3V4UW T/R
Description
TVS Diode Arrays DIODE ARRAY ESD TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PESD3V3V4UW T/R

Product Category
TVS Diode Arrays
Rohs
yes
Polarity
Unidirectional
Breakdown Voltage
5.3 V
Clamping Voltage
11 V
Operating Voltage
3.3 V
Peak Surge Current
2 A
Minimum Operating Temperature
- 65 C
Maximum Operating Temperature
+ 150 C
Dimensions
1.3 (Max) mm W x 1.7 (Max) mm L
Package / Case
SOT-665
Peak Pulse Power Dissipation
16 W
Factory Pack Quantity
4000
Part # Aliases
PESD3V3V4UW,115
NXP Semiconductors
PESDXV4UF_G_W_3
Product data sheet
Fig 16. Reflow soldering footprint PESDxV4UW (SOT665)
Reflow soldering is the only recommended soldering method.
2.00 1.70 1.00
0.075
Rev. 03 — 28 January 2008
0.70
(2 )
Very low capacitance quadruple ESD protection diode arrays
solder lands
solder resist
0.45
(2 )
placement area
occupied area
2.45
2.10
1.20
2.20
1.60
PESDxV4UF/G/W
1.375
1.25
Dimensions in mm
0.30
0.375
0.15
(2x)
(2 )
© NXP B.V. 2008. All rights reserved.
0.40
(5 )
0.55
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