MT46H32M32LFCM-5 IT:A Micron Technology Inc, MT46H32M32LFCM-5 IT:A Datasheet - Page 15
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MT46H32M32LFCM-5 IT:A
Manufacturer Part Number
MT46H32M32LFCM-5 IT:A
Description
IC DDR SDRAM 1GBIT 90VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H32M32LFCM-5 IT:A
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
1G (32M x 32)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
-40°C ~ 85°C
Package / Case
90-VFBGA
Organization
32Mx32
Density
1Gb
Address Bus
13b
Access Time (max)
6.5/5ns
Maximum Clock Rate
200MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
150mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Package Dimensions
Figure 6: 60-Ball VFBGA (10mm x 11.5mm)
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. L 04/10 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
Seating
plane
60X Ø0.45
0.1 A
7.2
0.8 TYP
0.8 TYP
3.6
A
Note:
9
8
1. All dimensions are in millimeters.
7
10 ±0.1
6.4
3.2
3
5 ±0.05
2
1
A
B
C
D
E
G
H
K
F
J
15
Ball A1 ID
5.75 ±0.05
0.65 ±0.05
11.5 ±0.1
1Gb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
Package Dimensions
Ball A1 ID
© 2007 Micron Technology, Inc. All rights reserved.