BZA418A /T2 NXP Semiconductors, BZA418A /T2 Datasheet - Page 6

• Manufacturer Part Number: BZA418A /T2
• Description: TVS Diode Arrays DIODE ARRAY TAPE-11 REVERSE
• Manufacturer: NXP Semiconductors
• Series: BAZ418Ar

Specifications of BZA418A /T2

• Product Category: TVS Diode Arrays
• Rohs: yes
• Polarity: Unidirectional
• Channels: 4 Channels
• Clamping Voltage: 27 V
• Operating Voltage: 18.9 V
• Peak Surge Current: 0.7 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Maximum Operating Temperature: + 150 C
• Dimensions: 1.7 (Max) mm W x 3.1 (Max) mm L
• Package / Case: SOT-457
• Peak Pulse Power Dissipation: 19.6 W
• Factory Pack Quantity: 10000
• Part # Aliases: BZA418A,165

NXP Semiconductors
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the
suppression of transients. The clamping voltage of the
BZA418A is determined by the peak transient current and
the rate of rise of that current (di/dt). Since parasitic
inductances can further add to the clamping voltage
(V = L di/dt) the series conductor lengths on the
printed-circuit board should be kept to a minimum. This
includes the lead length of the suppression element.
In addition to minimizing conductor length the following
printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with
4. Minimize all printed-circuit board loop areas including
5. Minimize the length of the transient return path to
6. Avoid using shared transient return paths to a common
2002 Sep 02
Quadruple ESD transient voltage
suppressor
terminals or connectors
unprotected conductors
power and ground loops
ground
ground point.
6
Product data sheet
BZA418A