PESD3V3S5UD T/R NXP Semiconductors, PESD3V3S5UD T/R Datasheet

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PESD3V3S5UD T/R

Manufacturer Part Number
PESD3V3S5UD T/R
Description
TVS Diode Arrays 3.3V 5X ESD ARRAY
Manufacturer
NXP Semiconductors
Series
PESDxS5UDr
Datasheet

Specifications of PESD3V3S5UD T/R

Product Category
TVS Diode Arrays
Rohs
yes
Polarity
Unidirectional
Channels
5 Channels
Breakdown Voltage
5.9 V
Clamping Voltage
12 V
Operating Voltage
3.3 V
Peak Surge Current
20 A
Mounting Style
SMD/SMT
Termination Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Maximum Operating Temperature
+ 150 C
Capacitance
300 pF
Dimensions
1.7 (Max) mm W x 3.1 (Max) mm L
Package / Case
SOT-457
Peak Pulse Power Dissipation
200 W
Factory Pack Quantity
3000
Part # Aliases
PESD3V3S5UD,115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Fivefold ElectroStatic Discharge (ESD) protection diode arrays in a SOT457 (SC-74) small
Surface-Mounted Device (SMD) plastic package designed to protect up to five signal lines
from the damage caused by ESD and other transients.
I
I
I
I
I
I
I
Table 1.
Symbol
Per diode
V
RWM
PESDxS5UD series
Fivefold ESD protection diode arrays
Rev. 02 — 7 December 2006
ESD protection of up to five lines
Max. peak pulse power: P
Ultra low leakage current: I
Low clamping voltage: V
I
Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
PP
= 20 A
Parameter
reverse standoff voltage
Quick reference data
PESD3V3S5UD
PESD5V0S5UD
PESD12VS5UD
PESD15VS5UD
PESD24VS5UD
CL
PP
RM
= 12 V at
= 200 W
= 50 pA
Conditions
I
I
I
I
I
I
ESD protection up to 30 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); I
Communication systems
Portable electronics
Subscriber Identity Module (SIM) card
protection
Min
-
-
-
-
-
Typ
-
-
-
-
-
Product data sheet
PP
Max
3.3
5
12
15
24
up to 20 A
Unit
V
V
V
V
V

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PESD3V3S5UD T/R Summary of contents

Page 1

PESDxS5UD series Fivefold ESD protection diode arrays Rev. 02 — 7 December 2006 1. Product profile 1.1 General description Fivefold ElectroStatic Discharge (ESD) protection diode arrays in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package designed to protect up ...

Page 2

... NXP Semiconductors Table 1. Symbol Pinning information Table 2. Pin Ordering information Table 3. Type number PESD3V3S5UD PESD5V0S5UD PESD12VS5UD PESD15VS5UD PESD24VS5UD 4. Marking Table 4. Type number PESD3V3S5UD PESD5V0S5UD PESD12VS5UD PESD15VS5UD PESD24VS5UD PESDXS5UD_SER_2 Product data sheet Quick reference data …continued Parameter Conditions diode capacitance MHz ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode Per device amb T stg [1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin ...

Page 4

... NXP Semiconductors 120 100 % (%) Fig 1. 8/20 s pulse waveform according to IEC 61000-4-5 6. Characteristics Table unless otherwise specified. amb Symbol Parameter Per diode V RWM PESDXS5UD_SER_2 Product data sheet 001aaa630 ...

Page 5

... NXP Semiconductors Table unless otherwise specified. amb Symbol Parameter dif [1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin ( amb Fig 3. Peak pulse power as a function of exponential pulse duration ...

Page 6

... NXP Semiconductors 220 C d (pF) 180 140 (1) (2) 100 MHz amb (1) PESD3V3S5UD (2) PESD5V0S5UD Fig 5. Diode capacitance as a function of reverse voltage; typical values RM( 100 50 0 PESD3V3S5UD; PESD5V0S5UD I is less than 150 C for: R PESD12VS5UD; PESD15VS5UD; PESD24VS5UD Fig 7. Relative variation of reverse leakage current as a function of junction temperature ...

Page 7

... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 s d GND unclamped 1 kV ESD voltage waveform (IEC 61000-4-2 network) GND unclamped 1 kV ESD voltage waveform (IEC 61000-4-2 network) Fig 9. ESD clamping test setup and waveforms PESDXS5UD_SER_2 Product data sheet ...

Page 8

... NXP Semiconductors 7. Application information The PESDxS5UD series is designed for the protection five unidirectional data lines from the damage caused by ESD and surge pulses. The PESDxS5UD series may be used on lines where the signal polarities are both, positive and negative with respect to ground ...

Page 9

... NXP Semiconductors 8. Package outline Fig 11. Package outline SOT457 (SC-74) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PESD3V3S5UD PESD5V0S5UD PESD12VS5UD PESD15VS5UD PESD24VS5UD [1] For further information and the availability of packing methods, see [2] T1: normal taping ...

Page 10

... NXP Semiconductors 10. Soldering Fig 12. Reflow soldering footprint SOT457 (SC-74) 5.05 Fig 13. Wave soldering footprint SOT457 (SC-74) PESDXS5UD_SER_2 Product data sheet 3.45 1.95 0.95 3.30 2.825 1.60 1.70 3.10 3.20 Dimensions in mm 5.30 1.40 4.30 Dimensions in mm Rev. 02 — 7 December 2006 PESDxS5UD series Fivefold ESD protection diode arrays solder lands solder resist 0.45 0.55 occupied area solder paste ...

Page 11

... Document ID Release date PESDXS5UD_SER_2 20061207 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 2 • Table 5 “Limiting • ...

Page 12

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 13

... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Legal information ...

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