IS42S32200E-7TLI ISSI, Integrated Silicon Solution Inc, IS42S32200E-7TLI Datasheet - Page 33

IC SDRAM 64MBIT 143MHZ 86TSOP

IS42S32200E-7TLI

Manufacturer Part Number
IS42S32200E-7TLI
Description
IC SDRAM 64MBIT 143MHZ 86TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheets

Specifications of IS42S32200E-7TLI

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
64M (2Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
-40°C ~ 85°C
Package / Case
86-TSOPII
Organization
2Mx32
Density
64Mb
Address Bus
13b
Access Time (max)
8/5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
140mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Data Bus Width
32 bit
Maximum Clock Frequency
143 MHz
Access Time
5.5 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Current
140 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
706-1082
IS42S32200E-7TLI

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IS42S32200E, IS45S32200E
DC RECOMMENDED OPERATING CONDITIONS
(T
Integrated Silicon Solution, Inc. — www.issi.com
Rev. D
07/12/2010
ABSOLUTE MAXIMUM RATINGS
CAPACITANCE CHARACTERISTICS
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
2. All voltages are referenced to GND.
3. V
4. V
5. An initial pause of 100us is required after power up, followed by two AUTO REFRESH commands, before proper device opera-
6. The parameter is characterized.
a
V
P
V
Symbol
V
V
V
I
T
T
= 0°C to +70°C for Com. grade. T
Symbol
C
C
CI/O
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
tion is ensured. (Vdd and VddQ must be powered up simultaneously. GND and GNDQ must be at same potential.) The two
AUTO REFRESH command wake-ups should be repeated anytime the t
cs
Symbol
opr
out
stg
ih
il
dd max
ddq max
iN
d max
dd
iN1
iN2
(min) = GND – 1.2V with a pulse < 3 ns. The pluse width cannot be greater than one third of the cycle rate.
V
(max) = V
V
, V
ih
il
ddq
ddq
Parameter
Input Capacitance: (CLK)
Input Capacitance: (All other input only pins)
Data Input/Output Capacitance: DQ0-DQ31
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
+ 1.2V with a pulse width ≤ 3 ns. The pluse width cannot be greater than one third of the cycle rate.
Parameters
Maximum Supply Voltage
Maximum Supply Voltage for Output Buffer
Input Voltage
Output Voltage
Allowable Power Dissipation
output Shorted Current
operating Temperature
Storage Temperature
a
= -40°C to +85°C for Ind. and A1 grade, T
(4)
(3)
(1)
(2, 6)
Min.
-0.3
3.0
2.0
(At T
Com.
a
Ind.
A1:
A2:
= 0 to +25°C, V
Typ.
3.3
(2,5)
V
a
dd
= -40°C to +105°C for A2 grade)
ref
Max.
+0.8
–1.0 to +4.6
–1.0 to +4.6
–1.0 to +4.6
–1.0 to +4.6
–40 to +105
–55 to +150
3.6
–40 to +85
–40 to +85
+ 0.3
0 to +70
refresh requirement is exceeded.
Rating
dd
50
1
= V
ddq
Unit
V
V
V
= 3.3 ± 0.3V, f = 1 MHz)
Unit
mA
°C
°C
W
V
V
V
V
Typ.
Max.
6
6
6
Unit
pF
pF
pF
33

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