MAC97A8/DG,116 NXP Semiconductors, MAC97A8/DG,116 Datasheet
MAC97A8/DG,116
Specifications of MAC97A8/DG,116
Related parts for MAC97A8/DG,116
MAC97A8/DG,116 Summary of contents
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MAC97A8; MAC97A6 Logic level triac Rev. 2 — 14 September 2011 1. Product profile 1.1 General description Logic level sensitive gate triac intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. Product ...
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... NXP Semiconductors 2. Pinning information Table 2. Pinning - SOT54 (TO-92), simplified outline and symbol Pin Description 1 main terminal 2 2 gate 3 main terminal 1 3. Ordering information Table 3. Ordering information Type number Package Name MAC97A8 TO-92 MAC97A6 TO-92 MAC97A8_A6 Product data sheet Simplified outline SOT54 (TO-92) Description Plastic single-ended leaded (through hole) package; 3 leads Plastic single-ended leaded (through hole) package ...
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... NXP Semiconductors 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak off-state voltage DRM MAC97A8 MAC97A6 I on-state current (RMS value) T(RMS) I non-repetitive peak on-state current TSM for fusing dI /dt ...
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... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction to lead th(j-lead) R thermal resistance from junction to ambient th(j-a) 5.1 Transient thermal impedance th(j-a) (K/ Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration. MAC97A8_A6 Product data sheet MAC97A8 ...
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... NXP Semiconductors 6. Characteristics Table 6. Characteristics unless otherwise specified j Symbol Parameter Static characteristics I gate trigger current GT I latching current L I holding current H V on-state voltage T V gate trigger voltage GT I off-state leakage current D Dynamic characteristics dV /dt critical rate of rise of D off-state voltage ...
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... NXP Semiconductors 1.2 P tot α (W) α 0.8 0 0.2 0.4 = conduction angle Fig 2. Maximum on-state dissipation as a function of RMS on-state current; typical values TSM ( number of cycles Fig 4. Maximum permissible non-repetitive peak on-state current as a function of number of cycles for sinusoidal currents; typical values. ...
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... NXP Semiconductors 3 I T(RMS) ( 50 Hz; T lead Fig 6. Maximum permissible repetitive RMS on-state current as a function of surge duration for sinusoidal currents; typical values GT(25°C) (1) (2) 2 (3) ( -60 - --------------------- - ...
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... NXP Semiconductors 2 H(25°C) 1.5 1.0 0.5 0 -60 - ------------------ - Fig 10. Normalized holding current as a function of junction temperature; typical values /dt D (V/μ Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values. ...
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... NXP Semiconductors 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package outline drawings have been updated to the latest version. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 11. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 5.1 Transient thermal impedance . . . . . . . . . . . . . . 4 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Legal information 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 9 ...