PUMB9,125 NXP Semiconductors, PUMB9,125 Datasheet - Page 9

• Manufacturer Part Number: PUMB9,125
• Description: Transistors Switching - Resistor Biased
• Manufacturer: NXP Semiconductors

Specifications of PUMB9,125

• Rohs: yes

NXP Semiconductors
10. Packing information
11. Soldering
PEMB9_PUMB9
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type
number
PEMB9
PUMB9
Fig 12. Reflow soldering footprint PEMB9 (SOT666)
2
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
1.7
1.075
Reflow soldering is the only recommended soldering method.
Packing methods
Package Description
SOT666
SOT363
0.538
All information provided in this document is subject to legal disclaimers.
0.55
(2×)
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
Rev. 3 — 22 November 2011
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 47 k
0.45
(4×)
(4×)
0.5
2.75
2.45
2.1
1.6
1.7
0.65
(2×)
(2×)
0.6
(6×)
0.4
PEMB9; PUMB9
0.325
0.25
(2×)
(4×)
[2]
[3]
Section
Packing quantity
3000
-
-
-115
-125
0.375
(2×)
(4×)
0.3
[1]
14.
4000
-
-115
-
-
Dimensions in mm
© NXP B.V. 2011. All rights reserved.
8000
-315
-
-
-
solder lands
placement area
solder paste
occupied area
sot666_fr
-
-
-165
10000
-135
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