PUMB9,125 NXP Semiconductors, PUMB9,125 Datasheet - Page 4

• Manufacturer Part Number: PUMB9,125
• Description: Transistors Switching - Resistor Biased
• Manufacturer: NXP Semiconductors

Specifications of PUMB9,125

• Rohs: yes

NXP Semiconductors
6. Thermal characteristics
PEMB9_PUMB9
Product data sheet
Table 7.
[1]
[2]
Symbol
Per transistor
R
Per device
R
Fig 1.
th(j-a)
th(j-a)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
FR4 PCB, standard footprint
Per device: Power derating curve for SOT363 (SC-88) and SOT666
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to ambient
PEMB9 (SOT666)
PUMB9 (SOT363)
PEMB9 (SOT666)
PUMB9 (SOT363)
All information provided in this document is subject to legal disclaimers.
(mW)
Rev. 3 — 22 November 2011
PNP/PNP resistor-equipped transistors; R1 = 10 k, R2 = 47 k
P
tot
400
300
200
100
0
-75
-25
Conditions
in free air
in free air
25
75
125
PEMB9; PUMB9
T
006aac749
amb
[1][2]
[1][2]
[1]
[1]
(°C)
175
Min
-
-
-
-
Typ
-
-
-
-
© NXP B.V. 2011. All rights reserved.
Max
625
625
417
417
Unit
K/W
K/W
K/W
K/W
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