IS61C256AL-12TLI-TR ISSI, Integrated Silicon Solution Inc, IS61C256AL-12TLI-TR Datasheet - Page 12

• Manufacturer Part Number: IS61C256AL-12TLI-TR
• Description: IC SRAM 256KBIT 12NS 28TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS61C256AL-12TLI-TR

• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Memory Size: 256K (32K x 8)
• Speed: 12ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-TSOP
• Density: 256Kb
• Access Time (max): 12ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 5V
• Address Bus: 15b
• Package Type: TSOP-I
• Operating Temp Range: -40C to 85C
• Number Of Ports: 1
• Supply Current: 25mA
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Word Size: 8b
• Number Of Words: 32K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant

PACKAGING INFORMATION
Plastic TSOP - 28-pins
Package Code: T (Type I)
Integrated Silicon Solution, Inc.
PK13197T28
Rev. B 01/31/97
No. Leads
S
Ref. Std.
Symbol
A1
A
B
C
D
E
H
e
L
11.70
13.20
1.00
0.05
0.16
0.10
7.90
0.30
Min
Plastic TSOP (T—Type I)
0
Millimeters
0.55 BSC
e
11.90
13.60
Max
1.20
0.20
0.27
0.20
8.10
0.70
N
1
5
D
28
0.037
0.002
0.006
0.004
0.308
0.456
0.515
0.011
Min
0.022 BSC
0
B
Inches
0.047
0.008
0.011
0.008
0.316
0.465
0.531
0.027
Max
5
E
A
A1
H
Notes:
1. Controlling dimension: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and
4. Formed leads shall be planar with respect to one another within
SEATING PLANE
should be measured from the bottom of the package
0.004 inches at the seating plane.
L
C
.
ISSI
®