IS61C256AL-12TLI-TR ISSI, Integrated Silicon Solution Inc, IS61C256AL-12TLI-TR Datasheet - Page 10

IC SRAM 256KBIT 12NS 28TSOP

IS61C256AL-12TLI-TR

Manufacturer Part Number
IS61C256AL-12TLI-TR
Description
IC SRAM 256KBIT 12NS 28TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61C256AL-12TLI-TR

Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
256K (32K x 8)
Speed
12ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
28-TSOP
Density
256Kb
Access Time (max)
12ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
15b
Package Type
TSOP-I
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
25mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
28
Word Size
8b
Number Of Words
32K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic SOJ
Package Code: J
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. D
02/25/03
Sym.
N0.
Leads
A
A1
A2
b
B
C
D
E
E1
E2
e
N
1
e
17.02
Min. Typ. Max.
2.41
0.41
0.66
0.20
8.26
7.49
6.27
0.64
MILLIMETERS
1.27 BSC
24/26
D
17.27
3.56
2.67
0.51
0.81
0.25
8.76
7.75
7.29
b
B
0.025
0.095
0.016
0.026
0.008
0.670
0.325
0.247
Min. Typ. Max.
0.295
0.050 BSC
INCHES
A
E1
A1
— 0.140
0.105
0.020
0.032
0.010
0.680
0.345
0.305
0.287
1-800-379-4774
E
SEATING PLANE
Notes:
1. Controlling dimension: inches, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
4. Formed leads shall be planar with respect to one
specified.
protrusions and
the package
another within 0.004 inches at the seating plane.
E2
.
should be measured from the bottom of
A2
ISSI
C
®

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