BUK7880-55 /T3 NXP Semiconductors, BUK7880-55 /T3 Datasheet - Page 4

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BUK7880-55 /T3

Manufacturer Part Number
BUK7880-55 /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK7880-55 /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
16 V
Continuous Drain Current
3.5 A
Configuration
Single Dual Drain
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-223
Fall Time
15 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
1800 mW
Rise Time
15 ns
Factory Pack Quantity
4000
Typical Turn-off Delay Time
18 ns
Part # Aliases
BUK7880-55,135
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK7880-55
Product data sheet
Symbol
R
R
Fig 5.
th(j-sp)
th(j-a)
Transient thermal impedance from junction to solder point as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
Z
(K/W)
th(j-mb)
10
10
10
10
−1
−2
1
2
10
−6
All information provided in this document is subject to legal disclaimers.
δ = 0.5
0.05
0.02
0.2
0.1
0
10
−5
Conditions
board
Mounted on FR4 PCB,
mounting pad for drain 6.5 cm
mounted on any printed-circuit
Rev. 3 — 21 April 2011
10
−4
10
−3
10
P
−2
10
t
p
−1
T
N-channel TrenchMOS standard level FET
003aaf271
1
δ =
t
p
(s)
T
t
t
p
2
10
Min
-
-
BUK7880-55
Typ
12
-
© NXP B.V. 2011. All rights reserved.
Max
15
70
Unit
K/W
K/W
4 of 13

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