BUK9609-75A /T3 NXP Semiconductors, BUK9609-75A /T3 Datasheet - Page 3

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BUK9609-75A /T3

Manufacturer Part Number
BUK9609-75A /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9609-75A /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
75 V
Gate-source Breakdown Voltage
+/- 10 V
Continuous Drain Current
75 A
Resistance Drain-source Rds (on)
0.0085 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
226 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
230 W
Rise Time
185 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
424 ns
Part # Aliases
BUK9609-75A,118
NXP Semiconductors
BUK9609-75A
Product data sheet
Fig 1.
Fig 3.
(A)
I
(%)
I
D
der
10
10
10
120
80
40
10
-1
3
2
1
0
10
function of mounting base temperature
Normalized continuous drain current as a
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
0
-1
50
Limit R
DSon
100
= V
DS
1
/ I
D
150
All information provided in this document is subject to legal disclaimers.
T
mb
03aa24
(°C)
200
Rev. 4 — 30 August 2011
10
DC
Fig 2.
P
(%)
der
120
80
40
0
function of mounting base temperature
Normalized total power dissipation as a
0
N-channel TrenchMOS logic level FET
50
10
2
t
100 μ s
10 ms
100 ms
p
1 ms
=10 μ s
BUK9609-75A
100
V
DS
150
(V)
© NXP B.V. 2011. All rights reserved.
T
mb
03nb44
03na19
(°C)
10
200
3
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