SIHG22N50D-GE3 Vishay/Siliconix, SIHG22N50D-GE3 Datasheet - Page 4

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SIHG22N50D-GE3

Manufacturer Part Number
SIHG22N50D-GE3
Description
MOSFET 500V 230mOhm@10V 22A N-Ch D-SRS
Manufacturer
Vishay/Siliconix
Datasheet

Specifications of SIHG22N50D-GE3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
500 V
Continuous Drain Current
22 A
Resistance Drain-source Rds (on)
230 mOhms at 10 V
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Package / Case
TO-247AC
Fall Time
40 ns
Forward Transconductance Gfs (max / Min)
8 S
Gate Charge Qg
49 nC
Minimum Operating Temperature
- 55 C
Power Dissipation
312 W
Rise Time
42 ns
Typical Turn-off Delay Time
47 ns
S12-1459-Rev. A, 18-Jun-12
Fig. 7 - Typical Source-Drain Diode Forward Voltage
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
1000
1000
100
100
0.1
0.1
10
10
1
1
0.2
1
* V
Fig. 8 - Maximum Safe Operating Area
Operation in this Area
Limited by R
T
T
T
Single Pulse
GS
C
J
J
0.01
= 150 °C
= 150 °C
0.1
= 25 °C
0.4
> minimum V
www.vishay.com
1
Limited by R
0.0001
V
V
SD
DS
I
DM
, Source-Drain Voltage (V)
0.05
, Drain-to-Source Voltage (V)
0.2
0.6
0.1
DS(on)
= Limited
Duty Cycle = 0.5
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
10
0.02
GS
DS(on)
0.8
at which R
T
Single Pulse
J
Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case
= 25 °C
1
BVDSS Limited
V
100
DS(on)
GS
1.2
= 0 V
0.001
For technical questions, contact:
is specified
1.4
1 ms
10 ms
100 μs
1000
1.6
Pulse Time (s)
4
0.01
hvm@vishay.com
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10 - Temperature vs. Drain-to-Source Voltage
625
600
575
550
525
500
475
25
20
15
10
5
0
- 60
25
www.vishay.com/doc?91000
- 40 - 20
T
50
J
0.1
T
, Junction Temperature (°C)
J
0
, Case Temperature (°C)
20 40 60 80 100 120 140
75
100
SiHG22N50D
Vishay Siliconix
Document Number: 91516
125
1
150
160

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