W9412G6JH-5 Winbond Electronics, W9412G6JH-5 Datasheet - Page 2

• Manufacturer Part Number: W9412G6JH-5
• Description: IC DDR-400 SDRAM 128MB 66TSSOPII
• Manufacturer: Winbond Electronics

Specifications of W9412G6JH-5

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 66-TSOPII
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.
9.
10.
11.
OPERATION MODE ................................................................................................................. 17
8.1
8.2
8.3
8.4
ELECTRICAL CHARACTERISTICS......................................................................................... 23
9.1
9.2
9.3
9.4
9.5
9.6
9.7
SYSTEM CHARACTERISTICS FOR DDR SDRAM................................................................. 29
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
TIMING WAVEFORMS ............................................................................................................. 34
11.1
11.2
11.3
11.4
11.5
11.6
7.10.1
7.10.2
7.10.3
7.10.4
7.10.5
7.10.6
7.10.7
Simplified Truth Table................................................................................................... 17
Function Truth Table..................................................................................................... 18
Function Truth Table for CKE ....................................................................................... 21
Simplified Stated Diagram ............................................................................................ 22
Absolute Maximum Ratings .......................................................................................... 23
Recommended DC Operating Conditions .................................................................... 23
Capacitance .................................................................................................................. 24
Leakage and Output Buffer Characteristics.................................................................. 24
DC Characteristics ........................................................................................................ 25
AC Characteristics and Operating Condition................................................................ 26
AC Test Conditions....................................................................................................... 27
Table 1: Input Slew Rate for DQ, DQS, and DM .......................................................... 29
Table 2: Input Setup & Hold Time Derating for Slew Rate ........................................... 29
Table 3: Input/Output Setup & Hold Time Derating for Slew Rate ............................... 29
Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate................ 29
Table 5: Output Slew Rate Characteristics (X16 Devices only) ................................... 29
Table 6: Output Slew Rate Matching Ratio Characteristics ......................................... 30
Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins......... 30
Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins.......... 31
System Notes:............................................................................................................... 32
Command Input Timing ................................................................................................ 34
Timing of the CLK Signals ............................................................................................ 34
Read Timing (Burst Length = 4) ................................................................................... 35
Write Timing (Burst Length = 4).................................................................................... 36
DM, DATA MASK (W9412G6JH) ................................................................................. 37
Mode Register Set (MRS) Timing................................................................................. 38
Burst Length field (A2 to A0)...................................................................... 14
Addressing Mode Select (A3) .................................................................... 15
CAS Latency field (A6 to A4) ..................................................................... 16
DLL Reset bit (A8) ..................................................................................... 16
Mode Register/Extended Mode register change bits (BA0, BA1).............. 16
Extended Mode Register field.................................................................... 16
Reserved field ............................................................................................ 16
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Publication Release Date: Apr. 02, 2010
W9412G6JH
Revision A01